CVE-2017-18140
Qualcomm Snapdragon Use After Free Memory Corruption Vulnerability
Description
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free condition may potentially occur.
INFO
Published Date :
April 11, 2018, 3:29 p.m.
Last Modified :
Nov. 21, 2024, 3:19 a.m.
Source :
[email protected]
Remotely Exploitable :
Yes !
Impact Score :
5.9
Exploitability Score :
3.9
Public PoC/Exploit Available at Github
CVE-2017-18140 has a 1 public PoC/Exploit available at Github.
Go to the Public Exploits tab to see the list.
Affected Products
The following products are affected by CVE-2017-18140
vulnerability.
Even if cvefeed.io is aware of the exact versions of the
products
that
are
affected, the information is not represented in the table below.
References to Advisories, Solutions, and Tools
Here, you will find a curated list of external links that provide in-depth
information, practical solutions, and valuable tools related to
CVE-2017-18140.
| URL | Resource |
|---|---|
| http://www.securityfocus.com/bid/103671 | Third Party Advisory VDB Entry |
| https://source.android.com/security/bulletin/2018-04-01 | Vendor Advisory |
| http://www.securityfocus.com/bid/103671 | Third Party Advisory VDB Entry |
| https://source.android.com/security/bulletin/2018-04-01 | Vendor Advisory |
We scan GitHub repositories to detect new proof-of-concept exploits. Following list is a collection of public exploits and proof-of-concepts, which have been published on GitHub (sorted by the most recently updated).
Samsung security patch description
Results are limited to the first 15 repositories due to potential performance issues.
The following list is the news that have been mention
CVE-2017-18140 vulnerability anywhere in the article.
The following table lists the changes that have been made to the
CVE-2017-18140 vulnerability over time.
Vulnerability history details can be useful for understanding the evolution of a vulnerability, and for identifying the most recent changes that may impact the vulnerability's severity, exploitability, or other characteristics.
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CVE Modified by af854a3a-2127-422b-91ae-364da2661108
Nov. 21, 2024
Action Type Old Value New Value Added Reference http://www.securityfocus.com/bid/103671 Added Reference https://source.android.com/security/bulletin/2018-04-01 -
CVE Modified by [email protected]
May. 14, 2024
Action Type Old Value New Value -
Initial Analysis by [email protected]
May. 11, 2018
Action Type Old Value New Value Added CVSS V2 (AV:N/AC:L/Au:N/C:C/I:C/A:C) Added CVSS V3 AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H Changed Reference Type http://www.securityfocus.com/bid/103671 No Types Assigned http://www.securityfocus.com/bid/103671 Third Party Advisory, VDB Entry Changed Reference Type https://source.android.com/security/bulletin/2018-04-01 No Types Assigned https://source.android.com/security/bulletin/2018-04-01 Vendor Advisory Added CWE CWE-416 Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_400_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_400:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_430:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_615:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_616:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_415:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_617_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_617:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_650:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_652:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_820a:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_808_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_808:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_810:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_820:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_845:-:*:*:*:*:*:*:* -
CVE Modified by [email protected]
Apr. 13, 2018
Action Type Old Value New Value Added Reference http://www.securityfocus.com/bid/103671 [No Types Assigned]
CWE - Common Weakness Enumeration
While CVE identifies
specific instances of vulnerabilities, CWE categorizes the common flaws or
weaknesses that can lead to vulnerabilities. CVE-2017-18140 is
associated with the following CWEs:
Common Attack Pattern Enumeration and Classification (CAPEC)
Common Attack Pattern Enumeration and Classification
(CAPEC)
stores attack patterns, which are descriptions of the common attributes and
approaches employed by adversaries to exploit the CVE-2017-18140
weaknesses.
Exploit Prediction
EPSS is a daily estimate of the probability of exploitation activity being observed over the next 30 days.
0.17 }} -0.01%
score
0.54545
percentile