CVE-2017-18172
Snapdragon Overflow Wraparound in System UI
Description
In a device, with screen size 1440x2560, the check of contiguous buffer will overflow on certain buffer size resulting in an Integer Overflow or Wraparound in System UI in Snapdragon Automobile, Snapdragon Mobile in version MDM9635M, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.
INFO
Published Date :
Oct. 23, 2018, 1:29 p.m.
Last Modified :
Nov. 21, 2024, 3:19 a.m.
Source :
[email protected]
Remotely Exploitable :
No
Impact Score :
5.9
Exploitability Score :
1.8
Public PoC/Exploit Available at Github
CVE-2017-18172 has a 1 public PoC/Exploit available at Github.
Go to the Public Exploits tab to see the list.
Affected Products
The following products are affected by CVE-2017-18172
vulnerability.
Even if cvefeed.io is aware of the exact versions of the
products
that
are
affected, the information is not represented in the table below.
References to Advisories, Solutions, and Tools
Here, you will find a curated list of external links that provide in-depth
information, practical solutions, and valuable tools related to
CVE-2017-18172.
| URL | Resource |
|---|---|
| https://source.android.com/security/bulletin/2018-07-01#qualcomm-closed-source-components | Vendor Advisory |
| https://www.qualcomm.com/company/product-security/bulletins | Vendor Advisory |
| https://source.android.com/security/bulletin/2018-07-01#qualcomm-closed-source-components | Vendor Advisory |
| https://www.qualcomm.com/company/product-security/bulletins | Vendor Advisory |
We scan GitHub repositories to detect new proof-of-concept exploits. Following list is a collection of public exploits and proof-of-concepts, which have been published on GitHub (sorted by the most recently updated).
Samsung security patch description
Results are limited to the first 15 repositories due to potential performance issues.
The following list is the news that have been mention
CVE-2017-18172 vulnerability anywhere in the article.
The following table lists the changes that have been made to the
CVE-2017-18172 vulnerability over time.
Vulnerability history details can be useful for understanding the evolution of a vulnerability, and for identifying the most recent changes that may impact the vulnerability's severity, exploitability, or other characteristics.
-
CVE Modified by af854a3a-2127-422b-91ae-364da2661108
Nov. 21, 2024
Action Type Old Value New Value Added Reference https://source.android.com/security/bulletin/2018-07-01#qualcomm-closed-source-components Added Reference https://www.qualcomm.com/company/product-security/bulletins -
CVE Modified by [email protected]
May. 14, 2024
Action Type Old Value New Value -
Initial Analysis by [email protected]
Dec. 13, 2018
Action Type Old Value New Value Added CVSS V2 (AV:L/AC:L/Au:N/C:C/I:C/A:C) Added CVSS V3 AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H Changed Reference Type https://www.qualcomm.com/company/product-security/bulletins No Types Assigned https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory Changed Reference Type https://source.android.com/security/bulletin/2018-07-01#qualcomm-closed-source-components No Types Assigned https://source.android.com/security/bulletin/2018-07-01#qualcomm-closed-source-components Vendor Advisory Added CWE CWE-190 Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9635m:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_400_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_400:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_410:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_412:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_427:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_430:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_435:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_615:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_616:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_415:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_650:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_652:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_820:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm630:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm636:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_617_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_617:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_800_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_800:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_810:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_820a:-:*:*:*:*:*:*:*
CWE - Common Weakness Enumeration
While CVE identifies
specific instances of vulnerabilities, CWE categorizes the common flaws or
weaknesses that can lead to vulnerabilities. CVE-2017-18172 is
associated with the following CWEs:
Common Attack Pattern Enumeration and Classification (CAPEC)
Common Attack Pattern Enumeration and Classification
(CAPEC)
stores attack patterns, which are descriptions of the common attributes and
approaches employed by adversaries to exploit the CVE-2017-18172
weaknesses.
Exploit Prediction
EPSS is a daily estimate of the probability of exploitation activity being observed over the next 30 days.
0.04 }} 0.00%
score
0.10264
percentile