7.8
HIGH
CVE-2017-18330
Snapdragon AES Encryption Buffer Overflow Vulnerability
Description

Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016.

INFO

Published Date :

Jan. 3, 2019, 3:29 p.m.

Last Modified :

Nov. 21, 2024, 3:19 a.m.

Remotely Exploitable :

No

Impact Score :

5.9

Exploitability Score :

1.8
Affected Products

The following products are affected by CVE-2017-18330 vulnerability. Even if cvefeed.io is aware of the exact versions of the products that are affected, the information is not represented in the table below.

ID Vendor Product Action
1 Qualcomm ipq8074_firmware
2 Qualcomm sdm660_firmware
3 Qualcomm msm8996au_firmware
4 Qualcomm sd_450_firmware
5 Qualcomm sd_625_firmware
6 Qualcomm sd_820_firmware
7 Qualcomm sd_820a_firmware
8 Qualcomm sd_835_firmware
9 Qualcomm sdx24_firmware
10 Qualcomm mdm9650_firmware
11 Qualcomm msm8909w_firmware
12 Qualcomm mdm9206_firmware
13 Qualcomm mdm9607_firmware
14 Qualcomm mdm9635m_firmware
15 Qualcomm mdm9640_firmware
16 Qualcomm sda660_firmware
17 Qualcomm sd_636_firmware
18 Qualcomm mdm9655_firmware
19 Qualcomm sdm630_firmware
20 Qualcomm sdm439_firmware
21 Qualcomm snapdragon_high_med_2016_firmware
22 Qualcomm sd_410_firmware
23 Qualcomm sd_412_firmware
24 Qualcomm sd_210_firmware
25 Qualcomm sd_212_firmware
26 Qualcomm sd_205_firmware
27 Qualcomm sd_425_firmware
28 Qualcomm sd_427_firmware
29 Qualcomm sd_430_firmware
30 Qualcomm sd_435_firmware
31 Qualcomm sd_439_firmware
32 Qualcomm sd_429_firmware
33 Qualcomm sd_615_firmware
34 Qualcomm sd_616_firmware
35 Qualcomm sd_415_firmware
36 Qualcomm sd_632_firmware
37 Qualcomm sd_650_firmware
38 Qualcomm sd_652_firmware
39 Qualcomm sd_810_firmware
40 Qualcomm mdm9206
41 Qualcomm mdm9607
42 Qualcomm mdm9635m
43 Qualcomm mdm9640
44 Qualcomm mdm9650
45 Qualcomm mdm9655
46 Qualcomm msm8909w
47 Qualcomm msm8996au
48 Qualcomm sd_636
49 Qualcomm sdm630
50 Qualcomm sdx24
51 Qualcomm ipq8074
52 Qualcomm sda660
53 Qualcomm sdm439
54 Qualcomm sdm660
55 Qualcomm sd_210
56 Qualcomm sd_212
57 Qualcomm sd_410
58 Qualcomm sd_425
59 Qualcomm sd_430
60 Qualcomm sd_615
61 Qualcomm sd_415
62 Qualcomm sd_625
63 Qualcomm sd_650
64 Qualcomm sd_820
65 Qualcomm sd_835
66 Qualcomm sd_412
67 Qualcomm sd_616
68 Qualcomm sd_652
69 Qualcomm sd_205
70 Qualcomm sd_450
71 Qualcomm sd_810
72 Qualcomm sd_427
73 Qualcomm sd_435
74 Qualcomm sd_820a
75 Qualcomm snapdragon_high_med_2016
76 Qualcomm sd_439
77 Qualcomm sd_429
78 Qualcomm sd_632
References to Advisories, Solutions, and Tools

Here, you will find a curated list of external links that provide in-depth information, practical solutions, and valuable tools related to CVE-2017-18330.

URL Resource
http://www.securityfocus.com/bid/106128 Third Party Advisory VDB Entry
https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory
http://www.securityfocus.com/bid/106128 Third Party Advisory VDB Entry
https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory

We scan GitHub repositories to detect new proof-of-concept exploits. Following list is a collection of public exploits and proof-of-concepts, which have been published on GitHub (sorted by the most recently updated).

Results are limited to the first 15 repositories due to potential performance issues.

The following list is the news that have been mention CVE-2017-18330 vulnerability anywhere in the article.

The following table lists the changes that have been made to the CVE-2017-18330 vulnerability over time.

Vulnerability history details can be useful for understanding the evolution of a vulnerability, and for identifying the most recent changes that may impact the vulnerability's severity, exploitability, or other characteristics.

  • CVE Modified by af854a3a-2127-422b-91ae-364da2661108

    Nov. 21, 2024

    Action Type Old Value New Value
    Added Reference http://www.securityfocus.com/bid/106128
    Added Reference https://www.qualcomm.com/company/product-security/bulletins
  • CVE Modified by [email protected]

    May. 14, 2024

    Action Type Old Value New Value
  • CWE Remap by [email protected]

    Oct. 03, 2019

    Action Type Old Value New Value
    Changed CWE CWE-119 CWE-119 NVD-CWE-noinfo
  • Initial Analysis by [email protected]

    Jan. 10, 2019

    Action Type Old Value New Value
    Added CVSS V2 (AV:L/AC:L/Au:N/C:C/I:C/A:C)
    Added CVSS V3 AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
    Changed Reference Type https://www.qualcomm.com/company/product-security/bulletins No Types Assigned https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory
    Changed Reference Type http://www.securityfocus.com/bid/106128 No Types Assigned http://www.securityfocus.com/bid/106128 Third Party Advisory, VDB Entry
    Added CWE CWE-119
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:ipq8074_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:ipq8074:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9635m:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9640:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9655:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:msm8996au:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_410:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_412:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_427:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_430:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_435:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_439:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_429:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_615:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_616:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_415:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_632_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_632:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_636:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_650:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_652:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_810_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_810:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_820:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_820a:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sda660:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm439:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm630:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdx24:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:snapdragon_high_med_2016:-:*:*:*:*:*:*:*
  • CVE Modified by [email protected]

    Jan. 04, 2019

    Action Type Old Value New Value
    Added Reference http://www.securityfocus.com/bid/106128 [No Types Assigned]
EPSS is a daily estimate of the probability of exploitation activity being observed over the next 30 days. Following chart shows the EPSS score history of the vulnerability.
CWE - Common Weakness Enumeration

While CVE identifies specific instances of vulnerabilities, CWE categorizes the common flaws or weaknesses that can lead to vulnerabilities. CVE-2017-18330 is associated with the following CWEs:

Common Attack Pattern Enumeration and Classification (CAPEC)

Common Attack Pattern Enumeration and Classification (CAPEC) stores attack patterns, which are descriptions of the common attributes and approaches employed by adversaries to exploit the CVE-2017-18330 weaknesses.

Exploit Prediction

EPSS is a daily estimate of the probability of exploitation activity being observed over the next 30 days.

0.04 }} 0.00%

score

0.10264

percentile

CVSS30 - Vulnerability Scoring System
Attack Vector
Attack Complexity
Privileges Required
User Interaction
Scope
Confidentiality
Integrity
Availability