7.8
HIGH
CVE-2018-11267
Snapdragon Out-of-Bounds Buffer Write Vulnerability
Description

In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20.

INFO

Published Date :

Sept. 20, 2018, 1:29 p.m.

Last Modified :

Nov. 21, 2024, 3:43 a.m.

Source :

[email protected]

Remotely Exploitable :

No

Impact Score :

5.9

Exploitability Score :

1.8
Affected Products

The following products are affected by CVE-2018-11267 vulnerability. Even if cvefeed.io is aware of the exact versions of the products that are affected, the information is not represented in the table below.

ID Vendor Product Action
1 Qualcomm sdm660_firmware
2 Qualcomm msm8996au_firmware
3 Qualcomm sd845_firmware
4 Qualcomm sd850_firmware
5 Qualcomm mdm9650_firmware
6 Qualcomm sd210_firmware
7 Qualcomm sd625_firmware
8 Qualcomm sd835_firmware
9 Qualcomm sdx20_firmware
10 Qualcomm sd205_firmware
11 Qualcomm mdm9206_firmware
12 Qualcomm mdm9607_firmware
13 Qualcomm mdm9640_firmware
14 Qualcomm sda660_firmware
15 Qualcomm sd820_firmware
16 Qualcomm mdm9615_firmware
17 Qualcomm mdm9655_firmware
18 Qualcomm sdm630_firmware
19 Qualcomm sd450_firmware
20 Qualcomm sd212_firmware
21 Qualcomm sd425_firmware
22 Qualcomm sd427_firmware
23 Qualcomm sd430_firmware
24 Qualcomm sd435_firmware
25 Qualcomm sd617_firmware
26 Qualcomm sd650_firmware
27 Qualcomm sd652_firmware
28 Qualcomm sd820a_firmware
29 Qualcomm sdm429_firmware
30 Qualcomm sdm439_firmware
31 Qualcomm sdm632_firmware
32 Qualcomm sdm636_firmware
33 Qualcomm sd410_firmware
34 Qualcomm sd412_firmware
35 Qualcomm sd615_firmware
36 Qualcomm sd616_firmware
37 Qualcomm sd415_firmware
38 Qualcomm sd600_firmware
39 Qualcomm snapdragon_high_med_2016_firmware
40 Qualcomm mdm9206
41 Qualcomm mdm9607
42 Qualcomm mdm9615
43 Qualcomm mdm9640
44 Qualcomm mdm9650
45 Qualcomm mdm9655
46 Qualcomm msm8996au
47 Qualcomm sd205
48 Qualcomm sd210
49 Qualcomm sd450
50 Qualcomm sd820
51 Qualcomm sd835
52 Qualcomm sd845
53 Qualcomm sd850
54 Qualcomm sdm630
55 Qualcomm sdx20
56 Qualcomm sda660
57 Qualcomm sdm429
58 Qualcomm sdm439
59 Qualcomm sdm632
60 Qualcomm sdm636
61 Qualcomm sdm660
62 Qualcomm sd625
63 Qualcomm sd212
64 Qualcomm snapdragon_high_med_2016
65 Qualcomm sd425
66 Qualcomm sd427
67 Qualcomm sd430
68 Qualcomm sd435
69 Qualcomm sd617
70 Qualcomm sd650
71 Qualcomm sd652
72 Qualcomm sd820a
73 Qualcomm sd410
74 Qualcomm sd412
75 Qualcomm sd615
76 Qualcomm sd616
77 Qualcomm sd415
78 Qualcomm sd600
: Total Affected Vendor : 1 | Products : 78
References to Advisories, Solutions, and Tools

Here, you will find a curated list of external links that provide in-depth information, practical solutions, and valuable tools related to CVE-2018-11267.

URL Resource
http://www.securityfocus.com/bid/106128 Third Party Advisory VDB Entry
https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory
http://www.securityfocus.com/bid/106128 Third Party Advisory VDB Entry
https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory

We scan GitHub repositories to detect new proof-of-concept exploits. Following list is a collection of public exploits and proof-of-concepts, which have been published on GitHub (sorted by the most recently updated).

Results are limited to the first 15 repositories due to potential performance issues.

The following list is the news that have been mention CVE-2018-11267 vulnerability anywhere in the article.

The following table lists the changes that have been made to the CVE-2018-11267 vulnerability over time.

Vulnerability history details can be useful for understanding the evolution of a vulnerability, and for identifying the most recent changes that may impact the vulnerability's severity, exploitability, or other characteristics.

  • CVE Modified by af854a3a-2127-422b-91ae-364da2661108

    Nov. 21, 2024

    Action Type Old Value New Value
    Added Reference http://www.securityfocus.com/bid/106128
    Added Reference https://www.qualcomm.com/company/product-security/bulletins
  • CVE Modified by [email protected]

    May. 14, 2024

    Action Type Old Value New Value
  • Modified Analysis by [email protected]

    Mar. 06, 2019

    Action Type Old Value New Value
    Changed Reference Type http://www.securityfocus.com/bid/106128 No Types Assigned http://www.securityfocus.com/bid/106128 Third Party Advisory, VDB Entry
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:snapdragon_high_med_2016:-:*:*:*:*:*:*:*
  • CVE Modified by [email protected]

    Dec. 07, 2018

    Action Type Old Value New Value
    Added Reference http://www.securityfocus.com/bid/106128 [No Types Assigned]
  • Initial Analysis by [email protected]

    Nov. 23, 2018

    Action Type Old Value New Value
    Added CVSS V2 (AV:L/AC:L/Au:N/C:C/I:C/A:C)
    Added CVSS V3 AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
    Changed Reference Type https://www.qualcomm.com/company/product-security/bulletins No Types Assigned https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory
    Added CWE CWE-129
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9615_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9615:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9640:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9655:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:msm8996au:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd210_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd210:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd212_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd212:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd205_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd205:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd410_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd410:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd412_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd412:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd425_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd425:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd427_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd427:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd430_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd430:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd435_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd435:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd450_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd450:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd600_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd600:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd615_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd615:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd616_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd616:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd415_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd415:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd617_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd617:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd625_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd625:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd650_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd650:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd652_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd652:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd820_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd820:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd820a_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd820a:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd835_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd835:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd845_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd845:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd850_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd850:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sda660:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm429_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm429:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm439:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm630:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm632_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm632:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm636:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdx20:-:*:*:*:*:*:*:*
EPSS is a daily estimate of the probability of exploitation activity being observed over the next 30 days. Following chart shows the EPSS score history of the vulnerability.
CWE - Common Weakness Enumeration

While CVE identifies specific instances of vulnerabilities, CWE categorizes the common flaws or weaknesses that can lead to vulnerabilities. CVE-2018-11267 is associated with the following CWEs:

Common Attack Pattern Enumeration and Classification (CAPEC)

Common Attack Pattern Enumeration and Classification (CAPEC) stores attack patterns, which are descriptions of the common attributes and approaches employed by adversaries to exploit the CVE-2018-11267 weaknesses.

Exploit Prediction

EPSS is a daily estimate of the probability of exploitation activity being observed over the next 30 days.

0.04 }} 0.00%

score

0.10264

percentile

CVSS30 - Vulnerability Scoring System
Attack Vector
Attack Complexity
Privileges Required
User Interaction
Scope
Confidentiality
Integrity
Availability
: