7.8
HIGH
CVE-2018-11847
"Snapdragon QSEE Overflow"
Description

Malicious TA can tag QSEE kernel memory and map to EL0, there by corrupting the physical memory as well it can be used to corrupt the QSEE kernel and compromise the whole TEE in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables and Snapdragon Wired Infrastructure and Networking in versions IPQ8074, MDM9206, MDM9607, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 650/52, SD 820, SD 820A, SD 835, SD 8CX, SDM439 and Snapdragon_High_Med_2016

INFO

Published Date :

Feb. 11, 2019, 3:29 p.m.

Last Modified :

Feb. 21, 2019, 8:42 p.m.

Source :

[email protected]

Remotely Exploitable :

No

Impact Score :

5.9

Exploitability Score :

1.8
Affected Products

The following products are affected by CVE-2018-11847 vulnerability. Even if cvefeed.io is aware of the exact versions of the products that are affected, the information is not represented in the table below.

ID Vendor Product Action
1 Qualcomm ipq8074_firmware
2 Qualcomm qca8081_firmware
3 Qualcomm sd_8cx_firmware
4 Qualcomm msm8996au_firmware
5 Qualcomm sd_450_firmware
6 Qualcomm sd_625_firmware
7 Qualcomm sd_820_firmware
8 Qualcomm sd_820a_firmware
9 Qualcomm sd_835_firmware
10 Qualcomm mdm9650_firmware
11 Qualcomm msm8909w_firmware
12 Qualcomm mdm9206_firmware
13 Qualcomm mdm9607_firmware
14 Qualcomm mdm9655_firmware
15 Qualcomm sdm439_firmware
16 Qualcomm snapdragon_high_med_2016_firmware
17 Qualcomm sd_410_firmware
18 Qualcomm sd_412_firmware
19 Qualcomm sd_210_firmware
20 Qualcomm sd_212_firmware
21 Qualcomm sd_205_firmware
22 Qualcomm sd_425_firmware
23 Qualcomm sd_427_firmware
24 Qualcomm sd_430_firmware
25 Qualcomm sd_435_firmware
26 Qualcomm sd_439_firmware
27 Qualcomm sd_429_firmware
28 Qualcomm sd_615_firmware
29 Qualcomm sd_616_firmware
30 Qualcomm sd_415_firmware
31 Qualcomm sd_632_firmware
32 Qualcomm sd_650_firmware
33 Qualcomm sd_652_firmware
: Total Affected Vendor : 1 | Products : 33
References to Advisories, Solutions, and Tools

Here, you will find a curated list of external links that provide in-depth information, practical solutions, and valuable tools related to CVE-2018-11847.

URL Resource
http://www.securityfocus.com/bid/106475 Third Party Advisory
https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory

We scan GitHub repositories to detect new proof-of-concept exploits. Following list is a collection of public exploits and proof-of-concepts, which have been published on GitHub (sorted by the most recently updated).

Results are limited to the first 15 repositories due to potential performance issues.

The following list is the news that have been mention CVE-2018-11847 vulnerability anywhere in the article.

The following table lists the changes that have been made to the CVE-2018-11847 vulnerability over time.

Vulnerability history details can be useful for understanding the evolution of a vulnerability, and for identifying the most recent changes that may impact the vulnerability's severity, exploitability, or other characteristics.

  • CVE Modified by [email protected]

    May. 14, 2024

    Action Type Old Value New Value
  • Initial Analysis by [email protected]

    Feb. 21, 2019

    Action Type Old Value New Value
    Added CVSS V2 (AV:L/AC:L/Au:N/C:C/I:C/A:C)
    Added CVSS V3 AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
    Changed Reference Type https://www.qualcomm.com/company/product-security/bulletins No Types Assigned https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory
    Changed Reference Type http://www.securityfocus.com/bid/106475 No Types Assigned http://www.securityfocus.com/bid/106475 Third Party Advisory
    Added CWE CWE-20
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:ipq8074_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:ipq8074:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9655_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9655:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:msm8996au:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qca8081_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qca8081:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_410_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_410:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_412_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_412:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_427:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_430:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_435:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_439:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_429:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_615:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_616:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_415:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_632_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_632:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_650:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_652:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_820:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_820a:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_8cx_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_8cx:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm439:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:snapdragon_high_med_2016:-:*:*:*:*:*:*:*
  • CVE Modified by [email protected]

    Feb. 12, 2019

    Action Type Old Value New Value
    Added Reference http://www.securityfocus.com/bid/106475 [No Types Assigned]
EPSS is a daily estimate of the probability of exploitation activity being observed over the next 30 days. Following chart shows the EPSS score history of the vulnerability.
CWE - Common Weakness Enumeration

While CVE identifies specific instances of vulnerabilities, CWE categorizes the common flaws or weaknesses that can lead to vulnerabilities. CVE-2018-11847 is associated with the following CWEs:

Common Attack Pattern Enumeration and Classification (CAPEC)

Common Attack Pattern Enumeration and Classification (CAPEC) stores attack patterns, which are descriptions of the common attributes and approaches employed by adversaries to exploit the CVE-2018-11847 weaknesses.

CAPEC-3: Using Leading 'Ghost' Character Sequences to Bypass Input Filters Using Leading 'Ghost' Character Sequences to Bypass Input Filters CAPEC-7: Blind SQL Injection Blind SQL Injection CAPEC-8: Buffer Overflow in an API Call Buffer Overflow in an API Call CAPEC-9: Buffer Overflow in Local Command-Line Utilities Buffer Overflow in Local Command-Line Utilities CAPEC-10: Buffer Overflow via Environment Variables Buffer Overflow via Environment Variables CAPEC-13: Subverting Environment Variable Values Subverting Environment Variable Values CAPEC-14: Client-side Injection-induced Buffer Overflow Client-side Injection-induced Buffer Overflow CAPEC-22: Exploiting Trust in Client Exploiting Trust in Client CAPEC-23: File Content Injection File Content Injection CAPEC-24: Filter Failure through Buffer Overflow Filter Failure through Buffer Overflow CAPEC-28: Fuzzing Fuzzing CAPEC-31: Accessing/Intercepting/Modifying HTTP Cookies Accessing/Intercepting/Modifying HTTP Cookies CAPEC-42: MIME Conversion MIME Conversion CAPEC-43: Exploiting Multiple Input Interpretation Layers Exploiting Multiple Input Interpretation Layers CAPEC-45: Buffer Overflow via Symbolic Links Buffer Overflow via Symbolic Links CAPEC-46: Overflow Variables and Tags Overflow Variables and Tags CAPEC-47: Buffer Overflow via Parameter Expansion Buffer Overflow via Parameter Expansion CAPEC-52: Embedding NULL Bytes Embedding NULL Bytes CAPEC-53: Postfix, Null Terminate, and Backslash Postfix, Null Terminate, and Backslash CAPEC-63: Cross-Site Scripting (XSS) Cross-Site Scripting (XSS) CAPEC-64: Using Slashes and URL Encoding Combined to Bypass Validation Logic Using Slashes and URL Encoding Combined to Bypass Validation Logic CAPEC-67: String Format Overflow in syslog() String Format Overflow in syslog() CAPEC-71: Using Unicode Encoding to Bypass Validation Logic Using Unicode Encoding to Bypass Validation Logic CAPEC-72: URL Encoding URL Encoding CAPEC-73: User-Controlled Filename User-Controlled Filename CAPEC-78: Using Escaped Slashes in Alternate Encoding Using Escaped Slashes in Alternate Encoding CAPEC-79: Using Slashes in Alternate Encoding Using Slashes in Alternate Encoding CAPEC-80: Using UTF-8 Encoding to Bypass Validation Logic Using UTF-8 Encoding to Bypass Validation Logic CAPEC-81: Web Server Logs Tampering Web Server Logs Tampering CAPEC-83: XPath Injection XPath Injection CAPEC-85: AJAX Footprinting AJAX Footprinting CAPEC-88: OS Command Injection OS Command Injection CAPEC-101: Server Side Include (SSI) Injection Server Side Include (SSI) Injection CAPEC-104: Cross Zone Scripting Cross Zone Scripting CAPEC-108: Command Line Execution through SQL Injection Command Line Execution through SQL Injection CAPEC-109: Object Relational Mapping Injection Object Relational Mapping Injection CAPEC-110: SQL Injection through SOAP Parameter Tampering SQL Injection through SOAP Parameter Tampering CAPEC-120: Double Encoding Double Encoding CAPEC-135: Format String Injection Format String Injection CAPEC-136: LDAP Injection LDAP Injection CAPEC-153: Input Data Manipulation Input Data Manipulation CAPEC-182: Flash Injection Flash Injection CAPEC-209: XSS Using MIME Type Mismatch XSS Using MIME Type Mismatch CAPEC-230: Serialized Data with Nested Payloads Serialized Data with Nested Payloads CAPEC-231: Oversized Serialized Data Payloads Oversized Serialized Data Payloads CAPEC-250: XML Injection XML Injection CAPEC-261: Fuzzing for garnering other adjacent user/sensitive data Fuzzing for garnering other adjacent user/sensitive data CAPEC-267: Leverage Alternate Encoding Leverage Alternate Encoding CAPEC-473: Signature Spoof Signature Spoof CAPEC-588: DOM-Based XSS DOM-Based XSS CAPEC-664: Server Side Request Forgery Server Side Request Forgery
Exploit Prediction

EPSS is a daily estimate of the probability of exploitation activity being observed over the next 30 days.

0.04 }} 0.00%

score

0.10264

percentile

CVSS30 - Vulnerability Scoring System
Attack Vector
Attack Complexity
Privileges Required
User Interaction
Scope
Confidentiality
Integrity
Availability
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