7.0
HIGH
CVE-2019-2260
Qualcomm Snapdragon Use After Free Race Condition
Description

A race condition occurs while processing perf-event which can lead to a use after free condition in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 712 / SD 710 / SD 670, SD 730, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, SDX20, SDX24, Snapdragon_High_Med_2016, SXR1130

INFO

Published Date :

July 22, 2019, 2:15 p.m.

Last Modified :

July 24, 2019, 1:22 p.m.

Source :

[email protected]

Remotely Exploitable :

No

Impact Score :

5.9

Exploitability Score :

1.0
Affected Products

The following products are affected by CVE-2019-2260 vulnerability. Even if cvefeed.io is aware of the exact versions of the products that are affected, the information is not represented in the table below.

ID Vendor Product Action
1 Qualcomm sdm660_firmware
2 Qualcomm sd_450_firmware
3 Qualcomm sd_625_firmware
4 Qualcomm sd_820a_firmware
5 Qualcomm sd_835_firmware
6 Qualcomm mdm9150_firmware
7 Qualcomm qcs605_firmware
8 Qualcomm sdx24_firmware
9 Qualcomm mdm9650_firmware
10 Qualcomm msm8909w_firmware
11 Qualcomm sdx20_firmware
12 Qualcomm qcs405_firmware
13 Qualcomm mdm9206_firmware
14 Qualcomm mdm9607_firmware
15 Qualcomm mdm9640_firmware
16 Qualcomm sd_636_firmware
17 Qualcomm sdm630_firmware
18 Qualcomm sdm439_firmware
19 Qualcomm snapdragon_high_med_2016_firmware
20 Qualcomm sd_210_firmware
21 Qualcomm sd_212_firmware
22 Qualcomm sd_205_firmware
23 Qualcomm sd_425_firmware
24 Qualcomm sd_427_firmware
25 Qualcomm sd_430_firmware
26 Qualcomm sd_435_firmware
27 Qualcomm sd_439_firmware
28 Qualcomm sd_429_firmware
29 Qualcomm sd_632_firmware
30 Qualcomm sd_712_firmware
31 Qualcomm sd_710_firmware
32 Qualcomm sd_670_firmware
33 Qualcomm sd_845_firmware
34 Qualcomm sd_850_firmware
35 Qualcomm sd_855_firmware
36 Qualcomm sxr1130_firmware
37 Qualcomm qualcomm_215_firmware
38 Qualcomm sd_665_firmware
39 Qualcomm sd_730_firmware
: Total Affected Vendor : 1 | Products : 39
References to Advisories, Solutions, and Tools

Here, you will find a curated list of external links that provide in-depth information, practical solutions, and valuable tools related to CVE-2019-2260.

URL Resource
https://www.codeaurora.org/security-bulletin/2019/06/03/june-2019-code-aurora-security-bulletin Patch Third Party Advisory

We scan GitHub repositories to detect new proof-of-concept exploits. Following list is a collection of public exploits and proof-of-concepts, which have been published on GitHub (sorted by the most recently updated).

Results are limited to the first 15 repositories due to potential performance issues.

The following list is the news that have been mention CVE-2019-2260 vulnerability anywhere in the article.

The following table lists the changes that have been made to the CVE-2019-2260 vulnerability over time.

Vulnerability history details can be useful for understanding the evolution of a vulnerability, and for identifying the most recent changes that may impact the vulnerability's severity, exploitability, or other characteristics.

  • CVE Modified by [email protected]

    May. 14, 2024

    Action Type Old Value New Value
  • Initial Analysis by [email protected]

    Jul. 24, 2019

    Action Type Old Value New Value
    Added CVSS V2 (AV:L/AC:M/Au:N/C:C/I:C/A:C)
    Added CVSS V3 AV:L/AC:H/PR:L/UI:N/S:U/C:H/I:H/A:H
    Changed Reference Type https://www.codeaurora.org/security-bulletin/2019/06/03/june-2019-code-aurora-security-bulletin No Types Assigned https://www.codeaurora.org/security-bulletin/2019/06/03/june-2019-code-aurora-security-bulletin Patch, Third Party Advisory
    Added CWE CWE-362
    Added CWE CWE-416
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9150:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9640:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qcs405:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qcs605:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qualcomm_215_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qualcomm_215:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_427:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_430:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_435:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_439:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_429:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_632_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_632:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_636:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_665_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_665:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_712:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_710:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_670:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_730_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_730:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_820a:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_845:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_850:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_855_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_855:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm439:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm630:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdx20:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdx24:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:snapdragon_high_med_2016:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sxr1130_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sxr1130:-:*:*:*:*:*:*:*
EPSS is a daily estimate of the probability of exploitation activity being observed over the next 30 days. Following chart shows the EPSS score history of the vulnerability.
CWE - Common Weakness Enumeration

While CVE identifies specific instances of vulnerabilities, CWE categorizes the common flaws or weaknesses that can lead to vulnerabilities. CVE-2019-2260 is associated with the following CWEs:

Common Attack Pattern Enumeration and Classification (CAPEC)

Common Attack Pattern Enumeration and Classification (CAPEC) stores attack patterns, which are descriptions of the common attributes and approaches employed by adversaries to exploit the CVE-2019-2260 weaknesses.

Exploit Prediction

EPSS is a daily estimate of the probability of exploitation activity being observed over the next 30 days.

0.04 }} 0.00%

score

0.10264

percentile

CVSS30 - Vulnerability Scoring System
Attack Vector
Attack Complexity
Privileges Required
User Interaction
Scope
Confidentiality
Integrity
Availability
: