9.3
CRITICAL
CVE-2023-21671
Sectools Fuse Corruptable System Call
Description

Memory Corruption in Core during syscall for Sectools Fuse comparison feature.

INFO

Published Date :

Nov. 7, 2023, 6:15 a.m.

Last Modified :

Nov. 21, 2024, 7:43 a.m.

Remotely Exploitable :

No

Impact Score :

6.0

Exploitability Score :

2.5
Affected Products

The following products are affected by CVE-2023-21671 vulnerability. Even if cvefeed.io is aware of the exact versions of the products that are affected, the information is not represented in the table below.

ID Vendor Product Action
1 Qualcomm qca6391_firmware
2 Qualcomm wcd9380_firmware
3 Qualcomm wcd9385_firmware
4 Qualcomm wsa8830_firmware
5 Qualcomm wsa8835_firmware
6 Qualcomm qcm6490_firmware
7 Qualcomm qcs6490_firmware
8 Qualcomm qsm8350_firmware
9 Qualcomm sd888_firmware
10 Qualcomm sm7315_firmware
11 Qualcomm sm7325p_firmware
12 Qualcomm snapdragon_7c\+_gen_3_compute_firmware
13 Qualcomm wcd9370_firmware
14 Qualcomm wcd9375_firmware
15 Qualcomm wcn6740_firmware
16 Qualcomm fastconnect_6900_firmware
17 Qualcomm fastconnect_6700_firmware
18 Qualcomm snapdragon_778g_5g_mobile_platform_firmware
19 Qualcomm snapdragon_778g\+_5g_mobile_platform_firmware
20 Qualcomm snapdragon_780g_5g_mobile_platform_firmware
21 Qualcomm snapdragon_782g_mobile_platform_firmware
22 Qualcomm snapdragon_888_5g_mobile_platform_firmware
23 Qualcomm snapdragon_888\+_5g_mobile_platform__firmware
24 Qualcomm qualcomm_video_collaboration_vc3_platform_firmware
25 Qualcomm qca6391
26 Qualcomm wcd9370
27 Qualcomm wcd9375
28 Qualcomm wcd9380
29 Qualcomm wcd9385
30 Qualcomm wcn6740
31 Qualcomm wsa8830
32 Qualcomm wsa8835
33 Qualcomm sd888
34 Qualcomm fastconnect_6700
35 Qualcomm fastconnect_6900
36 Qualcomm qcs6490
37 Qualcomm qualcomm_video_collaboration_vc3_platform
38 Qualcomm qcm6490
39 Qualcomm qsm8350
40 Qualcomm sm7315
41 Qualcomm sm7325p
42 Qualcomm snapdragon_778g_5g_mobile_platform
43 Qualcomm snapdragon_778g\+_5g_mobile_platform
44 Qualcomm snapdragon_780g_5g_mobile_platform
45 Qualcomm snapdragon_782g_mobile_platform
46 Qualcomm snapdragon_7c\+_gen_3_compute
47 Qualcomm snapdragon_888_5g_mobile_platform
48 Qualcomm snapdragon_888\+_5g_mobile_platform_
References to Advisories, Solutions, and Tools

Here, you will find a curated list of external links that provide in-depth information, practical solutions, and valuable tools related to CVE-2023-21671.

URL Resource
https://www.qualcomm.com/company/product-security/bulletins/november-2023-bulletin Vendor Advisory
https://www.qualcomm.com/company/product-security/bulletins/november-2023-bulletin Vendor Advisory

We scan GitHub repositories to detect new proof-of-concept exploits. Following list is a collection of public exploits and proof-of-concepts, which have been published on GitHub (sorted by the most recently updated).

Results are limited to the first 15 repositories due to potential performance issues.

The following list is the news that have been mention CVE-2023-21671 vulnerability anywhere in the article.

The following table lists the changes that have been made to the CVE-2023-21671 vulnerability over time.

Vulnerability history details can be useful for understanding the evolution of a vulnerability, and for identifying the most recent changes that may impact the vulnerability's severity, exploitability, or other characteristics.

  • CVE Modified by af854a3a-2127-422b-91ae-364da2661108

    Nov. 21, 2024

    Action Type Old Value New Value
    Added Reference https://www.qualcomm.com/company/product-security/bulletins/november-2023-bulletin
  • CVE Modified by [email protected]

    May. 14, 2024

    Action Type Old Value New Value
  • CVE Modified by [email protected]

    Apr. 12, 2024

    Action Type Old Value New Value
    Added CWE Qualcomm, Inc. CWE-20
  • Initial Analysis by [email protected]

    Nov. 14, 2023

    Action Type Old Value New Value
    Added CVSS V3.1 NIST AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
    Changed Reference Type https://www.qualcomm.com/company/product-security/bulletins/november-2023-bulletin No Types Assigned https://www.qualcomm.com/company/product-security/bulletins/november-2023-bulletin Vendor Advisory
    Added CWE NIST NVD-CWE-noinfo
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:fastconnect_6700:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:fastconnect_6900:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qca6391_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qca6391:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qcm6490:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qcs6490_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qcs6490:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qsm8350_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qsm8350:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qualcomm_video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qualcomm_video_collaboration_vc3_platform:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd888_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd888:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sm7315_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sm7315:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sm7325p_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sm7325p:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:snapdragon_778g_5g_mobile_platform_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:snapdragon_778g_5g_mobile_platform:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:snapdragon_778g\+_5g_mobile_platform_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:snapdragon_778g\+_5g_mobile_platform:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:snapdragon_780g_5g_mobile_platform_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:snapdragon_780g_5g_mobile_platform:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:snapdragon_782g_mobile_platform_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:snapdragon_782g_mobile_platform:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:snapdragon_7c\+_gen_3_compute_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:snapdragon_7c\+_gen_3_compute:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:snapdragon_888_5g_mobile_platform_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:snapdragon_888_5g_mobile_platform:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:snapdragon_888\+_5g_mobile_platform__firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:snapdragon_888\+_5g_mobile_platform_:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wcd9370:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wcd9375:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wcd9380:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wcd9385:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wcn6740_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wcn6740:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wsa8830:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wsa8835:-:*:*:*:*:*:*:*
  • CVE Received by [email protected]

    Nov. 07, 2023

    Action Type Old Value New Value
    Added Description Memory Corruption in Core during syscall for Sectools Fuse comparison feature.
    Added Reference Qualcomm, Inc. https://www.qualcomm.com/company/product-security/bulletins/november-2023-bulletin [No types assigned]
    Added CVSS V3.1 Qualcomm, Inc. AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H
EPSS is a daily estimate of the probability of exploitation activity being observed over the next 30 days. Following chart shows the EPSS score history of the vulnerability.
CWE - Common Weakness Enumeration

While CVE identifies specific instances of vulnerabilities, CWE categorizes the common flaws or weaknesses that can lead to vulnerabilities. CVE-2023-21671 is associated with the following CWEs:

Common Attack Pattern Enumeration and Classification (CAPEC)

Common Attack Pattern Enumeration and Classification (CAPEC) stores attack patterns, which are descriptions of the common attributes and approaches employed by adversaries to exploit the CVE-2023-21671 weaknesses.

CAPEC-3: Using Leading 'Ghost' Character Sequences to Bypass Input Filters Using Leading 'Ghost' Character Sequences to Bypass Input Filters CAPEC-7: Blind SQL Injection Blind SQL Injection CAPEC-8: Buffer Overflow in an API Call Buffer Overflow in an API Call CAPEC-9: Buffer Overflow in Local Command-Line Utilities Buffer Overflow in Local Command-Line Utilities CAPEC-10: Buffer Overflow via Environment Variables Buffer Overflow via Environment Variables CAPEC-13: Subverting Environment Variable Values Subverting Environment Variable Values CAPEC-14: Client-side Injection-induced Buffer Overflow Client-side Injection-induced Buffer Overflow CAPEC-22: Exploiting Trust in Client Exploiting Trust in Client CAPEC-23: File Content Injection File Content Injection CAPEC-24: Filter Failure through Buffer Overflow Filter Failure through Buffer Overflow CAPEC-28: Fuzzing Fuzzing CAPEC-31: Accessing/Intercepting/Modifying HTTP Cookies Accessing/Intercepting/Modifying HTTP Cookies CAPEC-42: MIME Conversion MIME Conversion CAPEC-43: Exploiting Multiple Input Interpretation Layers Exploiting Multiple Input Interpretation Layers CAPEC-45: Buffer Overflow via Symbolic Links Buffer Overflow via Symbolic Links CAPEC-46: Overflow Variables and Tags Overflow Variables and Tags CAPEC-47: Buffer Overflow via Parameter Expansion Buffer Overflow via Parameter Expansion CAPEC-52: Embedding NULL Bytes Embedding NULL Bytes CAPEC-53: Postfix, Null Terminate, and Backslash Postfix, Null Terminate, and Backslash CAPEC-63: Cross-Site Scripting (XSS) Cross-Site Scripting (XSS) CAPEC-64: Using Slashes and URL Encoding Combined to Bypass Validation Logic Using Slashes and URL Encoding Combined to Bypass Validation Logic CAPEC-67: String Format Overflow in syslog() String Format Overflow in syslog() CAPEC-71: Using Unicode Encoding to Bypass Validation Logic Using Unicode Encoding to Bypass Validation Logic CAPEC-72: URL Encoding URL Encoding CAPEC-73: User-Controlled Filename User-Controlled Filename CAPEC-78: Using Escaped Slashes in Alternate Encoding Using Escaped Slashes in Alternate Encoding CAPEC-79: Using Slashes in Alternate Encoding Using Slashes in Alternate Encoding CAPEC-80: Using UTF-8 Encoding to Bypass Validation Logic Using UTF-8 Encoding to Bypass Validation Logic CAPEC-81: Web Server Logs Tampering Web Server Logs Tampering CAPEC-83: XPath Injection XPath Injection CAPEC-85: AJAX Footprinting AJAX Footprinting CAPEC-88: OS Command Injection OS Command Injection CAPEC-101: Server Side Include (SSI) Injection Server Side Include (SSI) Injection CAPEC-104: Cross Zone Scripting Cross Zone Scripting CAPEC-108: Command Line Execution through SQL Injection Command Line Execution through SQL Injection CAPEC-109: Object Relational Mapping Injection Object Relational Mapping Injection CAPEC-110: SQL Injection through SOAP Parameter Tampering SQL Injection through SOAP Parameter Tampering CAPEC-120: Double Encoding Double Encoding CAPEC-135: Format String Injection Format String Injection CAPEC-136: LDAP Injection LDAP Injection CAPEC-153: Input Data Manipulation Input Data Manipulation CAPEC-182: Flash Injection Flash Injection CAPEC-209: XSS Using MIME Type Mismatch XSS Using MIME Type Mismatch CAPEC-230: Serialized Data with Nested Payloads Serialized Data with Nested Payloads CAPEC-231: Oversized Serialized Data Payloads Oversized Serialized Data Payloads CAPEC-250: XML Injection XML Injection CAPEC-261: Fuzzing for garnering other adjacent user/sensitive data Fuzzing for garnering other adjacent user/sensitive data CAPEC-267: Leverage Alternate Encoding Leverage Alternate Encoding CAPEC-473: Signature Spoof Signature Spoof CAPEC-588: DOM-Based XSS DOM-Based XSS CAPEC-664: Server Side Request Forgery Server Side Request Forgery
Exploit Prediction

EPSS is a daily estimate of the probability of exploitation activity being observed over the next 30 days.

0.04 }} 0.00%

score

0.07332

percentile

CVSS31 - Vulnerability Scoring System
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