CVE-2024-45576
Oracle OPE Command Buffer Buffer Memory Corruption
Description
Memory corruption while prociesing command buffer buffer in OPE module.
INFO
Published Date :
May 6, 2025, 9:15 a.m.
Last Modified :
May 9, 2025, 7:14 p.m.
Source :
[email protected]
Remotely Exploitable :
No
Impact Score :
5.9
Exploitability Score :
1.8
Affected Products
The following products are affected by CVE-2024-45576
vulnerability.
Even if cvefeed.io is aware of the exact versions of the
products
that
are
affected, the information is not represented in the table below.
References to Advisories, Solutions, and Tools
Here, you will find a curated list of external links that provide in-depth
information, practical solutions, and valuable tools related to
CVE-2024-45576.
| URL | Resource |
|---|---|
| https://docs.qualcomm.com/product/publicresources/securitybulletin/may-2025-bulletin.html | Patch Vendor Advisory |
We scan GitHub repositories to detect new proof-of-concept exploits. Following list is a collection of public exploits and proof-of-concepts, which have been published on GitHub (sorted by the most recently updated).
Results are limited to the first 15 repositories due to potential performance issues.
The following list is the news that have been mention
CVE-2024-45576 vulnerability anywhere in the article.
The following table lists the changes that have been made to the
CVE-2024-45576 vulnerability over time.
Vulnerability history details can be useful for understanding the evolution of a vulnerability, and for identifying the most recent changes that may impact the vulnerability's severity, exploitability, or other characteristics.
-
Initial Analysis by [email protected]
May. 09, 2025
Action Type Old Value New Value Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:fastconnect_6900:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:fastconnect_7800:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm429w_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm429w:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:snapdragon_429_mobile_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:snapdragon_429_mobile:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:snapdragon_8_gen_1_mobile_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:snapdragon_8_gen_1_mobile:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:snapdragon_w5+_gen_1_wearable_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:snapdragon_w5+_gen_1_wearable:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sw5100_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sw5100:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sw5100p_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sw5100p:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sxr2230p_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sxr2230p:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sxr2250p_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sxr2250p:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wcd9380:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wcd9385:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wcn3620_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wcn3620:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wcn3660b_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wcn3660b:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wcn3980_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wcn3980:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wcn3988:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wsa8830_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wsa8830:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wsa8832_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wsa8832:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wsa8835_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wsa8835:-:*:*:*:*:*:*:* Added Reference Type Qualcomm, Inc.: https://docs.qualcomm.com/product/publicresources/securitybulletin/may-2025-bulletin.html Types: Patch, Vendor Advisory -
New CVE Received by [email protected]
May. 06, 2025
Action Type Old Value New Value Added Description Memory corruption while prociesing command buffer buffer in OPE module. Added CVSS V3.1 AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H Added CWE CWE-129 Added Reference https://docs.qualcomm.com/product/publicresources/securitybulletin/may-2025-bulletin.html
CWE - Common Weakness Enumeration
While CVE identifies
specific instances of vulnerabilities, CWE categorizes the common flaws or
weaknesses that can lead to vulnerabilities. CVE-2024-45576 is
associated with the following CWEs:
Common Attack Pattern Enumeration and Classification (CAPEC)
Common Attack Pattern Enumeration and Classification
(CAPEC)
stores attack patterns, which are descriptions of the common attributes and
approaches employed by adversaries to exploit the CVE-2024-45576
weaknesses.