7.8
HIGH CVSS 3.1
CVE-2026-21372
Heap-Based Buffer Overflow in Power Management IC
Description

Memory Corruption when sending IOCTL requests with invalid buffer sizes during memcpy operations.

INFO

Published Date :

April 6, 2026, 4:16 p.m.

Last Modified :

April 8, 2026, 9:07 p.m.

Remotely Exploit :

No
Affected Products

The following products are affected by CVE-2026-21372 vulnerability. Even if cvefeed.io is aware of the exact versions of the products that are affected, the information is not represented in the table below.

ID Vendor Product Action
1 Qualcomm wcd9380_firmware
2 Qualcomm wcd9385_firmware
3 Qualcomm wcn3988_firmware
4 Qualcomm qcm6490_firmware
5 Qualcomm snapdragon_662_mobile_platform_firmware
6 Qualcomm snapdragon_7c\+_gen_3_compute_firmware
7 Qualcomm wcd9370_firmware
8 Qualcomm wcd9375_firmware
9 Qualcomm wcn3950_firmware
10 Qualcomm fastconnect_6900_firmware
11 Qualcomm fastconnect_7800_firmware
12 Qualcomm fastconnect_6700_firmware
13 Qualcomm snapdragon_460_mobile_platform_firmware
14 Qualcomm wsa8840_firmware
15 Qualcomm wsa8845_firmware
16 Qualcomm wsa8845h_firmware
17 Qualcomm wcd9370
18 Qualcomm wcd9375
19 Qualcomm wcd9380
20 Qualcomm wcd9385
21 Qualcomm wcn3950
22 Qualcomm wcn3988
23 Qualcomm qcm5430_firmware
24 Qualcomm fastconnect_6700
25 Qualcomm fastconnect_6900
26 Qualcomm fastconnect_7800
27 Qualcomm qcm5430
28 Qualcomm qcm6490
29 Qualcomm snapdragon_460_mobile_platform
30 Qualcomm snapdragon_662_mobile_platform
31 Qualcomm snapdragon_7c\+_gen_3_compute
32 Qualcomm wsa8840
33 Qualcomm wsa8845
34 Qualcomm wsa8845h
35 Qualcomm video_collaboration_vc3_platform_firmware
36 Qualcomm video_collaboration_vc3_platform
37 Qualcomm wcd9378c_firmware
38 Qualcomm wcd9378c
39 Qualcomm x2000077_firmware
40 Qualcomm x2000077
41 Qualcomm x2000086_firmware
42 Qualcomm x2000086
43 Qualcomm x2000090_firmware
44 Qualcomm x2000090
45 Qualcomm x2000092_firmware
46 Qualcomm x2000092
47 Qualcomm x2000094_firmware
48 Qualcomm x2000094
49 Qualcomm xg101002_firmware
50 Qualcomm xg101002
51 Qualcomm xg101032_firmware
52 Qualcomm xg101032
53 Qualcomm xg101039_firmware
54 Qualcomm xg101039
55 Qualcomm cologne_firmware
56 Qualcomm cologne
CVSS Scores
The Common Vulnerability Scoring System is a standardized framework for assessing the severity of vulnerabilities in software and systems. We collect and displays CVSS scores from various sources for each CVE.
Score Version Severity Vector Exploitability Score Impact Score Source
CVSS 3.1 HIGH 2cfc7d3e-20d3-47ac-8db7-1b7285aff15f
CVSS 3.1 HIGH [email protected]
Solution
Fix memory corruption by validating IOCTL buffer sizes before memcpy.
  • Validate IOCTL buffer sizes before memcpy.
  • Sanitize all input for memcpy operations.
  • Apply vendor patches for affected software.
References to Advisories, Solutions, and Tools

Here, you will find a curated list of external links that provide in-depth information, practical solutions, and valuable tools related to CVE-2026-21372.

URL Resource
https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2026-bulletin.html Vendor Advisory
CWE - Common Weakness Enumeration

While CVE identifies specific instances of vulnerabilities, CWE categorizes the common flaws or weaknesses that can lead to vulnerabilities. CVE-2026-21372 is associated with the following CWEs:

Common Attack Pattern Enumeration and Classification (CAPEC)

Common Attack Pattern Enumeration and Classification (CAPEC) stores attack patterns, which are descriptions of the common attributes and approaches employed by adversaries to exploit the CVE-2026-21372 weaknesses.

We scan GitHub repositories to detect new proof-of-concept exploits. Following list is a collection of public exploits and proof-of-concepts, which have been published on GitHub (sorted by the most recently updated).

Results are limited to the first 15 repositories due to potential performance issues.

The following list is the news that have been mention CVE-2026-21372 vulnerability anywhere in the article.

The following table lists the changes that have been made to the CVE-2026-21372 vulnerability over time.

Vulnerability history details can be useful for understanding the evolution of a vulnerability, and for identifying the most recent changes that may impact the vulnerability's severity, exploitability, or other characteristics.

  • Initial Analysis by [email protected]

    Apr. 08, 2026

    Action Type Old Value New Value
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:cologne_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:cologne:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:fastconnect_6700_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:fastconnect_6700:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:fastconnect_6900_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:fastconnect_6900:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:fastconnect_7800_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:fastconnect_7800:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qcm5430_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qcm5430:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qcm6490_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qcm6490:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:video_collaboration_vc3_platform_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:video_collaboration_vc3_platform:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:snapdragon_460_mobile_platform_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:snapdragon_460_mobile_platform:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:snapdragon_662_mobile_platform_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:snapdragon_662_mobile_platform:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:snapdragon_7c+_gen_3_compute_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:snapdragon_7c+_gen_3_compute:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wcd9370_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wcd9370:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wcd9375_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wcd9375:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wcd9378c_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wcd9378c:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wcd9380_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wcd9380:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wcd9385_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wcd9385:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wcn3950_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wcn3950:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wcn3988_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wcn3988:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wsa8840_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wsa8840:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wsa8845_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wsa8845:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:wsa8845h_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:wsa8845h:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:x2000077_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:x2000077:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:x2000086_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:x2000086:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:x2000090_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:x2000090:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:x2000092_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:x2000092:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:x2000094_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:x2000094:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:xg101002_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:xg101002:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:xg101032_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:xg101032:-:*:*:*:*:*:*:*
    Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:xg101039_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:xg101039:-:*:*:*:*:*:*:*
    Added Reference Type Qualcomm, Inc.: https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2026-bulletin.html Types: Vendor Advisory
  • New CVE Received by [email protected]

    Apr. 06, 2026

    Action Type Old Value New Value
    Added Description Memory Corruption when sending IOCTL requests with invalid buffer sizes during memcpy operations.
    Added CVSS V3.1 AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
    Added CWE CWE-122
    Added Reference https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2026-bulletin.html
EPSS is a daily estimate of the probability of exploitation activity being observed over the next 30 days. Following chart shows the EPSS score history of the vulnerability.