Product Detail

SNAPDRAGON 670 MOBILE FIRMWARE

Vendor :

Qualcomm

Number of CVE:

11

Average Exploit Prediction Score :

0

Public Exploit/PoC Code :

0

CISA Actively Exploited :

0

Last Vulnerability Seen :

Sep. 02, 2024
Vulnerabilities

The following vulnerabilities are recorded SNAPDRAGON 670 MOBILE FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Sep 02, 2024 CVE-2024-33060 HIGH
8.4
2 Sep 02, 2024 CVE-2024-33052 HIGH
7.8
3 May 06, 2024 CVE-2023-43530 HIGH
7.8
4 May 06, 2024 CVE-2023-33119 HIGH
8.4
5 Apr 01, 2024 CVE-2024-21468 HIGH
8.4
6 Apr 01, 2024 CVE-2023-33115 HIGH
7.8
7 Apr 01, 2024 CVE-2023-33023 HIGH
8.4
8 Apr 01, 2024 CVE-2023-28547 HIGH
8.4
9 Mar 04, 2024 CVE-2023-43548 CRITICAL
9.8
10 Mar 04, 2024 CVE-2023-33066 HIGH
8.4
11 Mar 04, 2024 CVE-2023-28578 CRITICAL
9.3
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Jan. 18, 2025 12:53