Product Detail

SNAPDRAGON 870 5G MOBILE PLATFORM SM8250 AC FIRMWARE

Vendor :

Qualcomm

Number of CVE:

2

Average Exploit Prediction Score :

0

Public Exploit/PoC Code :

0

CISA Actively Exploited :

0

Last Vulnerability Seen :

Oct. 07, 2024
Vulnerabilities

The following vulnerabilities are recorded SNAPDRAGON 870 5G MOBILE PLATFORM SM8250 AC FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Oct 07, 2024 CVE-2024-33069 HIGH
7.5
2 Oct 07, 2024 CVE-2024-23369 HIGH
7.8
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