Product Detail

SDM630 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

553

Average Exploit Prediction Score :

0.17

Public Exploit/PoC Code :

33

CISA Actively Exploited :

3

Last Vulnerability Seen :

Aug. 08, 2023
Vulnerabilities

The following vulnerabilities are recorded SDM630 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Aug 08, 2023 CVE-2023-28537 HIGH
8.4
2 Aug 08, 2023 CVE-2023-22666 HIGH
8.4
3 Aug 08, 2023 CVE-2023-21626 HIGH
7.1
4 Aug 08, 2023 CVE-2022-40510 CRITICAL
9.8
5 Mar 10, 2023 CVE-2022-40537 CRITICAL
9.8
6 Mar 10, 2023 CVE-2022-40531 HIGH
8.4
7 Mar 10, 2023 CVE-2022-33242 HIGH
7.8
8 Mar 10, 2023 CVE-2022-33213 HIGH
8.8
9 Mar 10, 2023 CVE-2022-25705 HIGH
7.8
10 Mar 10, 2023 CVE-2022-25694 HIGH
8.4
11 Mar 10, 2023 CVE-2022-25655 HIGH
8.4
12 Mar 10, 2023 CVE-2022-22075 MEDIUM
6.2
13 Feb 12, 2023 CVE-2022-40514 CRITICAL
9.8
14 Feb 12, 2023 CVE-2022-40512 HIGH
7.5
15 Feb 12, 2023 CVE-2022-33271 HIGH
8.2
16 Feb 12, 2023 CVE-2022-33248 HIGH
7.8
17 Feb 12, 2023 CVE-2022-33233 HIGH
7.8
18 Jan 09, 2023 CVE-2022-40520 HIGH
8.4
19 Jan 09, 2023 CVE-2022-40519 MEDIUM
6.8
20 Jan 09, 2023 CVE-2022-33286 HIGH
7.5
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Latest DB Update: Nov. 22, 2024 14:16