Product Detail

SD870 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

380

Average Exploit Prediction Score :

0.09

Public Exploit/PoC Code :

35

CISA Actively Exploited :

3

Last Vulnerability Seen :

Nov. 22, 2024
Vulnerabilities

The following vulnerabilities are recorded SD870 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Nov 22, 2024 CVE-2021-30299 MEDIUM
6.7
2 Sep 05, 2023 CVE-2023-28538 HIGH
8.4
3 Sep 05, 2023 CVE-2023-21667 MEDIUM
6.5
4 Sep 05, 2023 CVE-2023-21664 HIGH
7.8
5 Sep 05, 2023 CVE-2023-21662 HIGH
7.8
6 Sep 05, 2023 CVE-2023-21654 HIGH
7.8
7 Sep 05, 2023 CVE-2023-21646 HIGH
7.5
8 Sep 05, 2023 CVE-2023-21644 HIGH
7.8
9 Sep 05, 2023 CVE-2023-21636 HIGH
7.8
10 Sep 05, 2023 CVE-2022-40524 HIGH
7.8
11 Sep 05, 2023 CVE-2022-33220 MEDIUM
5.5
12 Aug 08, 2023 CVE-2023-28537 HIGH
8.4
13 Aug 08, 2023 CVE-2023-22666 HIGH
8.4
14 Aug 08, 2023 CVE-2023-21652 HIGH
7.7
15 Aug 08, 2023 CVE-2023-21651 CRITICAL
9.3
16 Aug 08, 2023 CVE-2023-21650 HIGH
7.8
17 Aug 08, 2023 CVE-2023-21649 HIGH
7.8
18 Aug 08, 2023 CVE-2023-21647 MEDIUM
6.5
19 Aug 08, 2023 CVE-2023-21627 HIGH
7.8
20 Aug 08, 2023 CVE-2023-21626 HIGH
7.1
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Dec. 23, 2024 0:03