Product Detail

SD870 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

379

Average Exploit Prediction Score :

0.08

Public Exploit/PoC Code :

33

CISA Actively Exploited :

3

Last Vulnerability Seen :

Sep. 05, 2023
Vulnerabilities

The following vulnerabilities are recorded SD870 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Sep 17, 2021 CVE-2021-1947 HIGH
8.4
2 Sep 17, 2021 CVE-2021-1939 HIGH
8.4
3 Sep 09, 2021 CVE-2021-30295 HIGH
8.4
4 Sep 09, 2021 CVE-2021-1974 HIGH
7.5
5 Sep 09, 2021 CVE-2021-1971 HIGH
7.5
6 Sep 09, 2021 CVE-2021-1963 MEDIUM
6.7
7 Sep 09, 2021 CVE-2021-1961 MEDIUM
6.7
8 Sep 09, 2021 CVE-2021-1960 MEDIUM
6.5
9 Sep 09, 2021 CVE-2021-1957 MEDIUM
6.5
10 Sep 09, 2021 CVE-2021-1952 HIGH
7.8
11 Sep 09, 2021 CVE-2021-1948 HIGH
7.5
12 Sep 09, 2021 CVE-2021-1946 CRITICAL
9.8
13 Sep 09, 2021 CVE-2021-1941 HIGH
7.5
14 Sep 09, 2021 CVE-2021-1935 HIGH
7.1
15 Sep 09, 2021 CVE-2021-1934 HIGH
8.4
16 Sep 09, 2021 CVE-2021-1909 HIGH
7.8
17 Sep 08, 2021 CVE-2021-1972 CRITICAL
9.8
18 Sep 08, 2021 CVE-2021-1930 HIGH
7.1
19 Sep 08, 2021 CVE-2021-1929 MEDIUM
6.2
20 Sep 08, 2021 CVE-2021-1923 HIGH
7.8
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 10, 2024 5:32