Product Detail

QCM2290 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

361

Average Exploit Prediction Score :

0.08

Public Exploit/PoC Code :

34

CISA Actively Exploited :

7

Last Vulnerability Seen :

Nov. 04, 2024
Vulnerabilities

The following vulnerabilities are recorded QCM2290 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Feb 12, 2023 CVE-2022-33248 HIGH
7.8
2 Feb 12, 2023 CVE-2022-33233 HIGH
7.8
3 Jan 09, 2023 CVE-2022-40519 MEDIUM
6.8
4 Jan 09, 2023 CVE-2022-40518 MEDIUM
6.8
5 Jan 09, 2023 CVE-2022-40517 HIGH
8.4
6 Jan 09, 2023 CVE-2022-40516 HIGH
8.4
7 Jan 09, 2023 CVE-2022-33286 HIGH
7.5
8 Jan 09, 2023 CVE-2022-33285 HIGH
7.5
9 Jan 09, 2023 CVE-2022-22088 CRITICAL
9.8
10 Dec 13, 2022 CVE-2022-33238 HIGH
7.5
11 Dec 13, 2022 CVE-2022-33235 HIGH
8.2
12 Dec 13, 2022 CVE-2022-25695 HIGH
8.4
13 Dec 13, 2022 CVE-2022-25685 HIGH
7.5
14 Dec 13, 2022 CVE-2022-25682 HIGH
8.4
15 Nov 15, 2022 CVE-2022-33239 HIGH
7.5
16 Nov 15, 2022 CVE-2022-33237 HIGH
7.5
17 Nov 15, 2022 CVE-2022-33234 CRITICAL
9.8
18 Nov 15, 2022 CVE-2022-25743 HIGH
8.4
19 Nov 15, 2022 CVE-2022-25741 HIGH
7.5
20 Nov 15, 2022 CVE-2022-25724 HIGH
8.4
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 10, 2024 3:23