Product Detail

QCM6490 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

370

Average Exploit Prediction Score :

0.07

Public Exploit/PoC Code :

25

CISA Actively Exploited :

4

Last Vulnerability Seen :

Nov. 04, 2024
Vulnerabilities

The following vulnerabilities are recorded QCM6490 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Feb 11, 2022 CVE-2021-35075 HIGH
8.4
2 Feb 11, 2022 CVE-2021-35074 HIGH
8.4
3 Feb 11, 2022 CVE-2021-35069 HIGH
7.8
4 Feb 11, 2022 CVE-2021-30326 HIGH
7.5
5 Feb 11, 2022 CVE-2021-30322 HIGH
7.8
6 Feb 11, 2022 CVE-2021-30318 HIGH
8.4
7 Feb 11, 2022 CVE-2021-30317 CRITICAL
9.3
8 Jan 13, 2022 CVE-2021-30353 HIGH
7.5
9 Jan 13, 2022 CVE-2021-30330 HIGH
7.5
10 Jan 13, 2022 CVE-2021-30319 HIGH
7.8
11 Jan 13, 2022 CVE-2021-30314 MEDIUM
6.2
12 Jan 13, 2022 CVE-2021-30313 MEDIUM
6.7
13 Jan 13, 2022 CVE-2021-30311 HIGH
7.8
14 Jan 13, 2022 CVE-2021-30307 HIGH
7.5
15 Jan 13, 2022 CVE-2021-30285 CRITICAL
9.3
16 Jan 03, 2022 CVE-2021-30351 CRITICAL
9.8
17 Jan 03, 2022 CVE-2021-30348 MEDIUM
6.5
18 Jan 03, 2022 CVE-2021-30337 HIGH
8.4
19 Jan 03, 2022 CVE-2021-30336 HIGH
8.4
20 Jan 03, 2022 CVE-2021-30303 HIGH
7.8
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 10, 2024 3:24