Product Detail

SD460 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

386

Average Exploit Prediction Score :

0.09

Public Exploit/PoC Code :

31

CISA Actively Exploited :

4

Last Vulnerability Seen :

Dec. 02, 2024
Vulnerabilities

The following vulnerabilities are recorded SD460 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Dec 02, 2024 CVE-2024-33056 HIGH
8.4
2 Sep 02, 2024 CVE-2024-33051 HIGH
7.5
3 Sep 02, 2024 CVE-2024-33016 MEDIUM
6.8
4 Sep 02, 2024 CVE-2024-23362 HIGH
7.1
5 Jul 01, 2024 CVE-2024-21469 HIGH
7.8
6 Jul 01, 2024 CVE-2024-21465 HIGH
7.8
7 Jul 01, 2024 CVE-2024-21462 HIGH
7.1
8 Jul 01, 2024 CVE-2024-21461 HIGH
8.4
9 Apr 01, 2024 CVE-2023-33023 HIGH
8.4
10 Apr 01, 2024 CVE-2023-28547 HIGH
8.4
11 Mar 04, 2024 CVE-2023-28578 CRITICAL
9.3
12 Feb 06, 2024 CVE-2023-43536 HIGH
7.5
13 Feb 06, 2024 CVE-2023-43533 HIGH
7.5
14 Feb 06, 2024 CVE-2023-43522 HIGH
7.5
15 Feb 06, 2024 CVE-2023-33072 CRITICAL
9.3
16 Jan 02, 2024 CVE-2023-43511 HIGH
7.5
17 Jan 02, 2024 CVE-2023-33109 HIGH
7.5
18 Jan 02, 2024 CVE-2023-33062 HIGH
7.5
19 Jan 02, 2024 CVE-2023-33040 HIGH
7.5
20 Jan 02, 2024 CVE-2023-33038 HIGH
7.8
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Dec. 22, 2024 23:09