Product Detail

SM6250P FIRMWARE

Vendor :

Qualcomm

Number of CVE:

333

Average Exploit Prediction Score :

0.09

Public Exploit/PoC Code :

23

CISA Actively Exploited :

3

Last Vulnerability Seen :

Nov. 04, 2024
Vulnerabilities

The following vulnerabilities are recorded SM6250P FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Feb 11, 2022 CVE-2021-30322 HIGH
7.8
2 Feb 11, 2022 CVE-2021-30318 HIGH
8.4
3 Feb 11, 2022 CVE-2021-30317 CRITICAL
9.3
4 Jan 13, 2022 CVE-2021-30353 HIGH
7.5
5 Jan 13, 2022 CVE-2021-30330 HIGH
7.5
6 Jan 13, 2022 CVE-2021-30319 HIGH
7.8
7 Jan 13, 2022 CVE-2021-30308 HIGH
7.8
8 Jan 13, 2022 CVE-2021-30307 HIGH
7.5
9 Jan 13, 2022 CVE-2021-30301 HIGH
7.5
10 Jan 13, 2022 CVE-2021-30300 HIGH
7.5
11 Jan 13, 2022 CVE-2021-30287 HIGH
7.5
12 Jan 13, 2022 CVE-2021-30285 CRITICAL
9.3
13 Jan 03, 2022 CVE-2021-30351 CRITICAL
9.8
14 Jan 03, 2022 CVE-2021-30348 MEDIUM
6.5
15 Jan 03, 2022 CVE-2021-30337 HIGH
8.4
16 Jan 03, 2022 CVE-2021-30335 HIGH
8.4
17 Jan 03, 2022 CVE-2021-30303 HIGH
7.8
18 Jan 03, 2022 CVE-2021-30289 HIGH
7.8
19 Jan 03, 2022 CVE-2021-30282 HIGH
8.4
20 Jan 03, 2022 CVE-2021-30278 HIGH
7.1
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 23, 2024 4:16