Vendor
H
Hardware
QUALCOMM
Vendor Security Posture
has published 11991 vulnerabilities in 2024.
12 have exploits , 0 scored > 90% EPSS and 1 in CISA KEV .
Total Vulnerabilities Breakdown
20493
CRITICAL
165031
HIGH
22346
MEDIUM
207870
Total CVE Number
Vulnerability Stream
Vulnerability Stream by Days
Products Security Index
The following products are associated with the
QUALCOMM vendor. You can explore the
security posture of each product by clicking on the product name.
| Product Name | Number of CVE | Latest CVE Release Date | Actions |
|---|---|---|---|
| Snapdragon 429 mobile platform | 87 | Jun 01, 2026 | |
| Qca7005 | 3 | Jun 01, 2026 | |
| Snapdragon ar1 gen 1 | 38 | May 04, 2026 | |
| Smart audio 400 | 55 | May 04, 2026 | |
| Snapdragon ar1 gen 1 | 4 | May 04, 2026 | |
| Snapdragon x75 5g modem rf | 83 | May 04, 2026 | |
| Snapdragon 695 5g mobile | 51 | May 04, 2026 | |
| Robotics rb2 | 19 | May 04, 2026 | |
| Snapdragon 685 4g mobile | 49 | May 04, 2026 | |
| Snapdragon 460 mobile | 39 | May 04, 2026 | |
| Snapdragon x72 5g modem rf | 50 | May 04, 2026 | |
| Snapdragon 480 5g mobile | 51 | May 04, 2026 | |
| Snapdragon 480 5g mobile | 51 | May 04, 2026 | |
| Snapdragon x35 5g modem rf | 47 | May 04, 2026 | |
| Snapdragon 7s gen 3 mobile | 6 | May 04, 2026 | |
| Snapdragon 6 gen 4 mobile | 6 | May 04, 2026 | |
| Dragonwing x100 accelerator card | 1 | May 04, 2026 | |
| Robotics rb5 | 61 | May 04, 2026 | |
| Snapdragon 8 gen 2 mobile | 79 | May 04, 2026 | |
| Snapdragon 8 gen 3 mobile | 90 | May 04, 2026 |