Vendor
H
Hardware
QUALCOMM
has published 13179 vulnerabilities in 2024.
14 have exploits , 0 scored > 90% EPSS and 3 in CISA KEV .
Total Vulnerabilities Breakdown
19928
CRITICAL
149238
HIGH
17110
MEDIUM
186276
Total CVE Number
Vulnerability Stream by Days
Products Security Index
The following products are associated with the
QUALCOMM
vendor. You can explore the
security posture of each product by clicking on the product name.
Product Name | Number of CVE | Latest CVE Release Date | Actions |
---|---|---|---|
Snapdragon 870 5g mobile platform | 78 | Dec 02, 2024 | |
Snapdragon 210 processor | 42 | Dec 02, 2024 | |
Snapdragon wear 2100 platform | 25 | Dec 02, 2024 | |
Snapdragon wear 2500 platform | 25 | Dec 02, 2024 | |
Snapdragon wear 3100 platform | 25 | Dec 02, 2024 | |
Snapdragon 208 processor | 38 | Dec 02, 2024 | |
Smart audio 200 platform | 32 | Dec 02, 2024 | |
Snapdragon 425 mobile platform | 30 | Dec 02, 2024 | |
Snapdragon 435 mobile platform | 11 | Dec 02, 2024 | |
Snapdragon 439 mobile platform | 29 | Dec 02, 2024 | |
Snapdragon 427 mobile platform | 11 | Dec 02, 2024 | |
Snapdragon 430 mobile platform | 22 | Dec 02, 2024 | |
Snapdragon 8cx gen 3 compute platform | 29 | Dec 02, 2024 | |
Snapdragon 8c compute platform | 33 | Dec 02, 2024 | |
Snapdragon 8cx compute platform | 34 | Dec 02, 2024 | |
Snapdragon 8cx gen 2 5g compute platform | 34 | Dec 02, 2024 | |
Sc8180x | 220 | Dec 02, 2024 | |
Snapdragon 480 5g mobile platform | 67 | Dec 02, 2024 | |
Snapdragon 685 4g mobile platform | 64 | Dec 02, 2024 | |
Snapdragon 860 mobile platform | 8 | Dec 02, 2024 |