Vendor
H
Hardware
QUALCOMM
has published 15664 vulnerabilities in 2024.
14 have exploits , 0 scored > 90% EPSS and 3 in CISA KEV .
Total Vulnerabilities Breakdown
19928
CRITICAL
150847
HIGH
17986
MEDIUM
188761
Total CVE Number
Vulnerability Stream by Days
Products Security Index
The following products are associated with the
QUALCOMM vendor. You can explore the
security posture of each product by clicking on the product name.
| Product Name | Number of CVE | Latest CVE Release Date | Actions |
|---|---|---|---|
| Snapdragon 6 gen 1 | 1 | Sep 02, 2024 | |
| Snapdragon 632 | 7 | Sep 02, 2024 | |
| Snapdragon 425 | 7 | Sep 02, 2024 | |
| Snapdragon 7 gen 2 | 1 | Sep 02, 2024 | |
| Snapdragon 625 | 7 | Sep 02, 2024 | |
| 860 mobile platform | 1 | Aug 05, 2024 | |
| Snapdragon 450 mobile platform | 7 | Aug 05, 2024 | |
| Snapdragon 860 mobile platform sm8150 ac | 2 | Aug 05, 2024 | |
| Mdm9230 | 65 | Aug 05, 2024 | |
| Snapdragon 855 mobile platform sm8150 ac | 1 | Aug 05, 2024 | |
| Mdm9330 | 67 | Aug 05, 2024 | |
| Mdm9630 | 65 | Aug 05, 2024 | |
| Snapdragon 855 mobile platform sm8150 ac | 1 | Aug 05, 2024 | |
| Snapdragon 8cx compute platform sc8180xpaf | 1 | Aug 05, 2024 | |
| Sm6225 ad | 55 | Jul 01, 2024 | |
| Sm4350 ac | 64 | Jul 01, 2024 | |
| Sm7325 af | 59 | Jul 01, 2024 | |
| Sm8350 ac | 74 | Jul 01, 2024 | |
| Sm8150 ac | 62 | Jul 01, 2024 | |
| Sm7250 ab | 62 | Jul 01, 2024 |