Vendor
H
Hardware
QUALCOMM
has published 11123 vulnerabilities in 2024.
1 have exploits , 0 scored > 90% EPSS and 0 in CISA KEV .
Total Vulnerabilities Breakdown
11916
CRITICAL
41628
HIGH
3976
MEDIUM
57520
Total CVE Number
Vulnerability Stream by Days
Product Maturity Index
The following products are associated with the
QUALCOMM vendor. You can explore the
security posture of each product by clicking on the product name.
| Product Name | Number of CVE | Latest CVE Release Date |
|---|---|---|
| Snapdragon ar2 gen1 platform | 1 | Jun 06, 2023 |
| Snapdragon auto 4g | 15 | Sep 02, 2024 |
| Snapdragon auto 4g modem | 72 | Jul 01, 2024 |
| Snapdragon auto 5g | 19 | Sep 05, 2023 |
| Snapdragon auto 5g modem rf | 1 | May 02, 2023 |
| Snapdragon auto 5g modem rf | 117 | Sep 02, 2024 |
| Snapdragon auto 5g modem rf gen 2 | 47 | Sep 02, 2024 |
| Snapdragon auto 5g rf | 1 | Sep 02, 2024 |
| Snapdragon auto 5g rf gen 2 | 1 | Sep 02, 2024 |
| Snapdragon sc8180x aa | 9 | Dec 05, 2023 |
| Snapdragon sc8180x ac | 9 | Dec 05, 2023 |
| Snapdragon sc8180x ad | 9 | Dec 05, 2023 |
| Snapdragon sc8180xp aa | 9 | Dec 05, 2023 |
| Snapdragon sc8180xp ac | 9 | Dec 05, 2023 |
| Snapdragon sc8180xp ad | 9 | Dec 05, 2023 |
| Snapdragon sc8280xp ab | 8 | Dec 05, 2023 |
| Snapdragon w5 gen 1 | 20 | Sep 02, 2024 |
| Snapdragon w5 gen 1 wearable | 5 | Sep 02, 2024 |
| Snapdragon w5 gen 1 wearable platform | 115 | Jul 01, 2024 |
| Snapdragon w5 gen1 wearable platform | 1 | Jun 06, 2023 |