CVE-2018-13888
Qualcomm Snapdragon RIL Daemon Memory Corruption
Description
There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605.
INFO
Published Date :
Feb. 11, 2019, 3:29 p.m.
Last Modified :
Feb. 14, 2019, 6:21 p.m.
Source :
[email protected]
Remotely Exploitable :
No
Impact Score :
5.9
Exploitability Score :
1.8
Affected Products
The following products are affected by CVE-2018-13888
vulnerability.
Even if cvefeed.io is aware of the exact versions of the
products
that
are
affected, the information is not represented in the table below.
References to Advisories, Solutions, and Tools
Here, you will find a curated list of external links that provide in-depth
information, practical solutions, and valuable tools related to
CVE-2018-13888.
| URL | Resource |
|---|---|
| http://www.securityfocus.com/bid/106475 | Third Party Advisory |
| https://www.qualcomm.com/company/product-security/bulletins | Vendor Advisory |
We scan GitHub repositories to detect new proof-of-concept exploits. Following list is a collection of public exploits and proof-of-concepts, which have been published on GitHub (sorted by the most recently updated).
Results are limited to the first 15 repositories due to potential performance issues.
The following list is the news that have been mention
CVE-2018-13888 vulnerability anywhere in the article.
The following table lists the changes that have been made to the
CVE-2018-13888 vulnerability over time.
Vulnerability history details can be useful for understanding the evolution of a vulnerability, and for identifying the most recent changes that may impact the vulnerability's severity, exploitability, or other characteristics.
-
CVE Modified by [email protected]
May. 14, 2024
Action Type Old Value New Value -
Initial Analysis by [email protected]
Feb. 14, 2019
Action Type Old Value New Value Added CVSS V2 (AV:L/AC:L/Au:N/C:C/I:C/A:C) Added CVSS V3 AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H Changed Reference Type https://www.qualcomm.com/company/product-security/bulletins No Types Assigned https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory Changed Reference Type http://www.securityfocus.com/bid/106475 No Types Assigned http://www.securityfocus.com/bid/106475 Third Party Advisory Added CWE CWE-119 Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9635m_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9635m:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_427:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_430:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_435:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_439_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_439:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_429_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_429:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_636:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_650:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_652:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_675:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_712:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_710:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_670:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_820a:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_845:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_850:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_855_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_855:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm439_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm439:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm630:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:zz_qcs605_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:zz_qcs605:-:*:*:*:*:*:*:* -
CVE Modified by [email protected]
Feb. 12, 2019
Action Type Old Value New Value Added Reference http://www.securityfocus.com/bid/106475 [No Types Assigned]
CWE - Common Weakness Enumeration
While CVE identifies
specific instances of vulnerabilities, CWE categorizes the common flaws or
weaknesses that can lead to vulnerabilities. CVE-2018-13888 is
associated with the following CWEs:
Common Attack Pattern Enumeration and Classification (CAPEC)
Common Attack Pattern Enumeration and Classification
(CAPEC)
stores attack patterns, which are descriptions of the common attributes and
approaches employed by adversaries to exploit the CVE-2018-13888
weaknesses.
Exploit Prediction
EPSS is a daily estimate of the probability of exploitation activity being observed over the next 30 days.
0.04 }} 0.00%
score
0.10264
percentile