CVE-2019-2297
Snapdragon Buffer Overflow Vulnerability
Description
Buffer overflow can occur while processing non-standard NAN message from user space. in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8064, APQ8096AU, IPQ4019, IPQ8064, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8996AU, QCA6174A, QCA6574AU, QCA9377, QCA9379, QCN7605, QCS405, QCS605, SDA660, SDA845, SDM636, SDM660, SDM845, SDX20, SDX24, SM8150
INFO
Published Date :
Nov. 21, 2019, 3:15 p.m.
Last Modified :
July 21, 2021, 11:39 a.m.
Source :
[email protected]
Remotely Exploitable :
No
Impact Score :
5.9
Exploitability Score :
1.8
Public PoC/Exploit Available at Github
CVE-2019-2297 has a 1 public PoC/Exploit
available at Github.
Go to the Public Exploits
tab to see the list.
Affected Products
The following products are affected by CVE-2019-2297
vulnerability.
Even if cvefeed.io
is aware of the exact versions of the
products
that
are
affected, the information is not represented in the table below.
References to Advisories, Solutions, and Tools
Here, you will find a curated list of external links that provide in-depth
information, practical solutions, and valuable tools related to
CVE-2019-2297
.
URL | Resource |
---|---|
https://www.qualcomm.com/company/product-security/bulletins/october-2019-bulletin | Patch Vendor Advisory |
We scan GitHub repositories to detect new proof-of-concept exploits. Following list is a collection of public exploits and proof-of-concepts, which have been published on GitHub (sorted by the most recently updated).
This project contains pocs and exploits for vulneribilities I found (mostly)
Makefile C Assembly Python Shell HTML CMake Batchfile Meson Roff
Results are limited to the first 15 repositories due to potential performance issues.
The following list is the news that have been mention
CVE-2019-2297
vulnerability anywhere in the article.
The following table lists the changes that have been made to the
CVE-2019-2297
vulnerability over time.
Vulnerability history details can be useful for understanding the evolution of a vulnerability, and for identifying the most recent changes that may impact the vulnerability's severity, exploitability, or other characteristics.
-
CVE Modified by [email protected]
May. 14, 2024
Action Type Old Value New Value -
CWE Remap by [email protected]
Jul. 21, 2021
Action Type Old Value New Value Changed CWE CWE-191 CWE-119 CWE-190 -
Initial Analysis by [email protected]
Nov. 25, 2019
Action Type Old Value New Value Added CVSS V2 NIST (AV:L/AC:L/Au:N/C:P/I:P/A:P) Added CVSS V3.1 NIST AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H Changed Reference Type https://www.qualcomm.com/company/product-security/bulletins/october-2019-bulletin No Types Assigned https://www.qualcomm.com/company/product-security/bulletins/october-2019-bulletin Patch, Vendor Advisory Added CWE NIST CWE-191 Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:apq8009:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:apq8017_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:apq8017:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:apq8053:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:apq8064_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:apq8064:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:apq8096au_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:apq8096au:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:ipq4019_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:ipq4019:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:ipq8064_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:ipq8064:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:ipq8074_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:ipq8074:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9207c_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9207c:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9640:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:msm8905_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:msm8905:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:msm8996au:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qca6174a:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qca6574au:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qca9377_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qca9377:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qca9379_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qca9379:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qcn7605_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qcn7605:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qcs405:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qcs605:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sda660_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sda660:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sda845_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sda845:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm636_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm636:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm845_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm845:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdx20:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdx24:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sm8150_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sm8150:-:*:*:*:*:*:*:*
CWE - Common Weakness Enumeration
While CVE identifies
specific instances of vulnerabilities, CWE categorizes the common flaws or
weaknesses that can lead to vulnerabilities. CVE-2019-2297
is
associated with the following CWEs:
Common Attack Pattern Enumeration and Classification (CAPEC)
Common Attack Pattern Enumeration and Classification
(CAPEC)
stores attack patterns, which are descriptions of the common attributes and
approaches employed by adversaries to exploit the CVE-2019-2297
weaknesses.
Exploit Prediction
EPSS is a daily estimate of the probability of exploitation activity being observed over the next 30 days.
0.04 }} 0.00%
score
0.10264
percentile