CVE-2019-2312
Snapdragon Buffer Overflow Vulnerability
Description
When handling the vendor command there exists a potential buffer overflow due to lack of input validation of data buffer received in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9607, MDM9640, MSM8996AU, QCA6174A, QCA6574AU, QCA9377, QCA9379, QCS405, QCS605, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 625, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM630, SDM660, SDX24
INFO
Published Date :
July 25, 2019, 5:15 p.m.
Last Modified :
July 29, 2019, 7:57 p.m.
Source :
[email protected]
Remotely Exploitable :
No
Impact Score :
5.9
Exploitability Score :
1.8
Public PoC/Exploit Available at Github
CVE-2019-2312 has a 1 public PoC/Exploit available at Github.
Go to the Public Exploits tab to see the list.
Affected Products
The following products are affected by CVE-2019-2312
vulnerability.
Even if cvefeed.io is aware of the exact versions of the
products
that
are
affected, the information is not represented in the table below.
References to Advisories, Solutions, and Tools
Here, you will find a curated list of external links that provide in-depth
information, practical solutions, and valuable tools related to
CVE-2019-2312.
| URL | Resource |
|---|---|
| https://www.codeaurora.org/security-bulletin/2019/07/01/july-2019-code-aurora-security-bulletin | Patch Third Party Advisory |
We scan GitHub repositories to detect new proof-of-concept exploits. Following list is a collection of public exploits and proof-of-concepts, which have been published on GitHub (sorted by the most recently updated).
This project contains pocs and exploits for vulneribilities I found (mostly)
Makefile C Assembly Python Shell HTML CMake Batchfile Meson Roff
Results are limited to the first 15 repositories due to potential performance issues.
The following list is the news that have been mention
CVE-2019-2312 vulnerability anywhere in the article.
The following table lists the changes that have been made to the
CVE-2019-2312 vulnerability over time.
Vulnerability history details can be useful for understanding the evolution of a vulnerability, and for identifying the most recent changes that may impact the vulnerability's severity, exploitability, or other characteristics.
-
CVE Modified by [email protected]
May. 14, 2024
Action Type Old Value New Value -
Initial Analysis by [email protected]
Jul. 29, 2019
Action Type Old Value New Value Added CVSS V2 (AV:L/AC:L/Au:N/C:P/I:P/A:P) Added CVSS V3 AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H Changed Reference Type https://www.codeaurora.org/security-bulletin/2019/07/01/july-2019-code-aurora-security-bulletin No Types Assigned https://www.codeaurora.org/security-bulletin/2019/07/01/july-2019-code-aurora-security-bulletin Patch, Third Party Advisory Added CWE CWE-119 Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:mdm9640_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:mdm9640:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:msm8996au:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qca6174a_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qca6174a:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qca6574au_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qca6574au:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qca9377_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qca9377:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qca9379_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qca9379:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qcs405_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qcs405:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:qcs605_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:qcs605:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_427_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_427:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_430_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_430:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_435_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_435:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_600_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_600:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_636_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_636:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_665_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_665:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_675_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_675:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_712_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_712:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_710_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_710:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_670_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_670:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_730_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_730:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_820:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_820a:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_845:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_850_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_850:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sd_855_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sd_855:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm630_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm630:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdm660_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdm660:-:*:*:*:*:*:*:* Added CPE Configuration AND OR *cpe:2.3:o:qualcomm:sdx24_firmware:-:*:*:*:*:*:*:* OR cpe:2.3:h:qualcomm:sdx24:-:*:*:*:*:*:*:*
CWE - Common Weakness Enumeration
While CVE identifies
specific instances of vulnerabilities, CWE categorizes the common flaws or
weaknesses that can lead to vulnerabilities. CVE-2019-2312 is
associated with the following CWEs:
Common Attack Pattern Enumeration and Classification (CAPEC)
Common Attack Pattern Enumeration and Classification
(CAPEC)
stores attack patterns, which are descriptions of the common attributes and
approaches employed by adversaries to exploit the CVE-2019-2312
weaknesses.
Exploit Prediction
EPSS is a daily estimate of the probability of exploitation activity being observed over the next 30 days.
0.04 }} 0.00%
score
0.10264
percentile