Product Detail

SNAPDRAGON 870 5G MOBILE FIRMWARE

Vendor :

Qualcomm

Number of CVE:

33

Average Exploit Prediction Score :

0

Public Exploit/PoC Code :

4

CISA Actively Exploited :

1

Last Vulnerability Seen :

Jan. 06, 2025
Vulnerabilities

The following vulnerabilities are recorded SNAPDRAGON 870 5G MOBILE FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Apr 01, 2024 CVE-2023-33099 HIGH
7.5
2 Apr 01, 2024 CVE-2023-33023 HIGH
8.4
3 Apr 01, 2024 CVE-2023-28547 HIGH
8.4
4 Mar 04, 2024 CVE-2023-43549 HIGH
8.4
5 Mar 04, 2024 CVE-2023-43548 CRITICAL
9.8
6 Mar 04, 2024 CVE-2023-43539 HIGH
7.5
7 Mar 04, 2024 CVE-2023-33104 HIGH
7.5
8 Mar 04, 2024 CVE-2023-33096 HIGH
7.5
9 Mar 04, 2024 CVE-2023-33095 HIGH
7.5
10 Mar 04, 2024 CVE-2023-33090 MEDIUM
5.5
11 Mar 04, 2024 CVE-2023-33086 HIGH
7.5
12 Mar 04, 2024 CVE-2023-33066 HIGH
8.4
13 Mar 04, 2024 CVE-2023-28578 CRITICAL
9.3
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Jan. 18, 2025 19:30