Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

313

Average Exploit Prediction Score :

0.09

Public Exploit/PoC Code :

28

CISA Actively Exploited :

5

Last Vulnerability Seen :

Dec. 02, 2024
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Feb 22, 2021 CVE-2020-11278 HIGH
7.5
2 Feb 22, 2021 CVE-2020-11276 CRITICAL
9.1
3 Feb 22, 2021 CVE-2020-11275 CRITICAL
9.1
4 Feb 22, 2021 CVE-2020-11270 HIGH
7.5
5 Feb 22, 2021 CVE-2020-11269 HIGH
8.8
6 Feb 22, 2021 CVE-2020-11204 HIGH
7.8
7 Feb 22, 2021 CVE-2020-11198 MEDIUM
6.7
8 Feb 22, 2021 CVE-2020-11195 HIGH
7.8
9 Feb 22, 2021 CVE-2020-11194 HIGH
7.8
10 Feb 22, 2021 CVE-2020-11177 HIGH
8.8
11 Feb 22, 2021 CVE-2020-11170 CRITICAL
9.8
12 Feb 22, 2021 CVE-2020-11147 MEDIUM
6.7
13 Jan 21, 2021 CVE-2020-11119 HIGH
7.5
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Dec. 22, 2024 23:45