Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

333

Average Exploit Prediction Score :

0.21

Public Exploit/PoC Code :

34

CISA Actively Exploited :

5

Last Vulnerability Seen :

Jul. 08, 2025
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Sep 08, 2021 CVE-2021-1916 CRITICAL
9.8
2 Sep 08, 2021 CVE-2021-1914 HIGH
7.5
3 Sep 08, 2021 CVE-2021-1904 MEDIUM
6.2
4 Sep 08, 2021 CVE-2020-11301 CRITICAL
9.1
5 Jul 13, 2021 CVE-2021-1970 HIGH
7.5
6 Jul 13, 2021 CVE-2021-1964 HIGH
7.5
7 Jul 13, 2021 CVE-2021-1955 HIGH
7.5
8 Jul 13, 2021 CVE-2021-1953 HIGH
7.5
9 Jul 13, 2021 CVE-2021-1945 HIGH
7.5
10 Jul 13, 2021 CVE-2021-1943 HIGH
7.5
11 Jul 13, 2021 CVE-2021-1938 HIGH
7.5
12 Jul 13, 2021 CVE-2021-1931 MEDIUM
6.7
13 Jul 13, 2021 CVE-2021-1907 HIGH
7.5
14 Jul 13, 2021 CVE-2021-1890 HIGH
8.4
15 Jul 13, 2021 CVE-2021-1889 HIGH
8.4
16 Jul 13, 2021 CVE-2021-1888 HIGH
8.4
17 Jul 13, 2021 CVE-2021-1886 HIGH
8.4
18 Jul 13, 2021 CVE-2020-11307 CRITICAL
9.8
19 Jun 09, 2021 CVE-2021-1937 HIGH
7.5
20 Jun 09, 2021 CVE-2021-1900 HIGH
8.4
SEVERITY DISTRIBUTION CHART