Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

297

Average Exploit Prediction Score :

0.09

Public Exploit/PoC Code :

27

CISA Actively Exploited :

5

Last Vulnerability Seen :

Nov. 04, 2024
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Feb 06, 2024 CVE-2023-33077 HIGH
7.8
2 Feb 06, 2024 CVE-2023-33076 HIGH
7.8
3 Feb 06, 2024 CVE-2023-33072 CRITICAL
9.3
4 Jan 02, 2024 CVE-2023-43511 HIGH
7.5
5 Jan 02, 2024 CVE-2023-33120 HIGH
7.8
6 Jan 02, 2024 CVE-2023-33109 HIGH
7.5
7 Jan 02, 2024 CVE-2023-33062 HIGH
7.5
8 Jan 02, 2024 CVE-2023-33036 HIGH
7.1
9 Jan 02, 2024 CVE-2023-33033 HIGH
8.4
10 Jan 02, 2024 CVE-2023-33030 CRITICAL
9.3
11 Dec 05, 2023 CVE-2023-33107 HIGH
8.4
12 Dec 05, 2023 CVE-2023-33088 HIGH
8.4
13 Dec 05, 2023 CVE-2023-33080 HIGH
7.5
14 Dec 05, 2023 CVE-2023-33063 HIGH
7.8
15 Dec 05, 2023 CVE-2023-33022 HIGH
8.4
16 Dec 05, 2023 CVE-2023-33018 HIGH
7.8
17 Dec 05, 2023 CVE-2023-33017 HIGH
7.8
18 Dec 05, 2023 CVE-2023-28588 HIGH
7.5
19 Dec 05, 2023 CVE-2023-28586 MEDIUM
6.5
20 Dec 05, 2023 CVE-2023-28585 HIGH
8.8
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 22, 2024 18:41