Product Detail

SD670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

297

Average Exploit Prediction Score :

0.09

Public Exploit/PoC Code :

27

CISA Actively Exploited :

5

Last Vulnerability Seen :

Nov. 04, 2024
Vulnerabilities

The following vulnerabilities are recorded SD670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jul 04, 2023 CVE-2023-21633 HIGH
7.8
2 Jul 04, 2023 CVE-2023-21629 MEDIUM
6.8
3 Jun 06, 2023 CVE-2023-21670 HIGH
7.8
4 Jun 06, 2023 CVE-2023-21659 HIGH
7.5
5 Jun 06, 2023 CVE-2023-21628 HIGH
8.4
6 Jun 06, 2023 CVE-2022-40529 HIGH
7.8
7 Jun 06, 2023 CVE-2022-40523 HIGH
7.1
8 Jun 06, 2023 CVE-2022-40521 HIGH
7.5
9 Jun 06, 2023 CVE-2022-40507 HIGH
8.4
10 Jun 06, 2023 CVE-2022-33307 HIGH
8.4
11 Jun 06, 2023 CVE-2022-33264 HIGH
7.9
12 Jun 06, 2023 CVE-2022-22076 HIGH
7.1
13 May 02, 2023 CVE-2022-40504 HIGH
7.5
14 May 02, 2023 CVE-2022-33273 HIGH
7.3
15 May 02, 2023 CVE-2023-21666 HIGH
8.4
16 May 02, 2023 CVE-2023-21665 HIGH
8.4
17 Apr 13, 2023 CVE-2022-40532 HIGH
8.4
18 Apr 13, 2023 CVE-2022-40503 HIGH
8.2
19 Apr 13, 2023 CVE-2022-33302 HIGH
7.8
20 Apr 13, 2023 CVE-2022-33296 HIGH
7.8
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 22, 2024 23:39