Product Detail

SNAPDRAGON 870 5G MOBILE PLATFORM FIRMWARE

Vendor :

Qualcomm

Number of CVE:

64

Average Exploit Prediction Score :

0.05

Public Exploit/PoC Code :

9

CISA Actively Exploited :

2

Last Vulnerability Seen :

Nov. 04, 2024
Vulnerabilities

The following vulnerabilities are recorded SNAPDRAGON 870 5G MOBILE PLATFORM FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Feb 06, 2024 CVE-2023-33057 HIGH
7.5
2 Feb 06, 2024 CVE-2023-33049 HIGH
7.5
3 Jan 02, 2024 CVE-2023-43511 HIGH
7.5
4 Jan 02, 2024 CVE-2023-33120 HIGH
7.8
5 Jan 02, 2024 CVE-2023-33118 HIGH
7.8
6 Jan 02, 2024 CVE-2023-33117 HIGH
7.8
7 Jan 02, 2024 CVE-2023-33114 HIGH
8.4
8 Jan 02, 2024 CVE-2023-33110 HIGH
7.8
9 Jan 02, 2024 CVE-2023-33109 HIGH
7.5
10 Jan 02, 2024 CVE-2023-33094 HIGH
8.4
11 Jan 02, 2024 CVE-2023-33062 HIGH
7.5
12 Jan 02, 2024 CVE-2023-33040 HIGH
7.5
13 Jan 02, 2024 CVE-2023-33038 HIGH
7.8
14 Jan 02, 2024 CVE-2023-33037 HIGH
7.1
15 Jan 02, 2024 CVE-2023-33036 HIGH
7.1
16 Jan 02, 2024 CVE-2023-33033 HIGH
8.4
17 Jan 02, 2024 CVE-2023-33030 CRITICAL
9.3
18 Dec 05, 2023 CVE-2023-33107 HIGH
8.4
19 Dec 05, 2023 CVE-2023-33106 HIGH
8.4
20 Dec 05, 2023 CVE-2023-33098 HIGH
7.5
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 10, 2024 0:02