Product Detail

MDM9607 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

730

Average Exploit Prediction Score :

0.14

Public Exploit/PoC Code :

33

CISA Actively Exploited :

2

Last Vulnerability Seen :

Aug. 08, 2023
Vulnerabilities

The following vulnerabilities are recorded MDM9607 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jun 14, 2022 CVE-2021-35116 HIGH
7.7
2 Jun 14, 2022 CVE-2021-35104 CRITICAL
9.8
3 Jun 14, 2022 CVE-2021-35100 HIGH
7.5
4 Jun 14, 2022 CVE-2021-35083 CRITICAL
9.1
5 Jun 14, 2022 CVE-2021-35072 HIGH
7.8
6 Jun 14, 2022 CVE-2021-30344 HIGH
7.5
7 Jun 14, 2022 CVE-2021-30342 CRITICAL
9.1
8 Jun 14, 2022 CVE-2021-30341 CRITICAL
9.8
9 Apr 01, 2022 CVE-2021-35105 HIGH
8.4
10 Apr 01, 2022 CVE-2021-30333 HIGH
7.8
11 Feb 11, 2022 CVE-2021-30323 HIGH
7.8
12 Feb 11, 2022 CVE-2021-30318 HIGH
8.4
13 Jan 13, 2022 CVE-2021-30330 HIGH
7.5
14 Jan 13, 2022 CVE-2021-30319 HIGH
7.8
15 Jan 13, 2022 CVE-2021-30300 HIGH
7.5
16 Jan 03, 2022 CVE-2021-30351 CRITICAL
9.8
17 Jan 03, 2022 CVE-2021-30348 MEDIUM
6.5
18 Jan 03, 2022 CVE-2021-30337 HIGH
8.4
19 Jan 03, 2022 CVE-2021-30303 HIGH
7.8
20 Jan 03, 2022 CVE-2021-30293 HIGH
7.5
Showing 20 of 730 Results
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