Product Detail

MDM9607 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

736

Average Exploit Prediction Score :

0.25

Public Exploit/PoC Code :

35

CISA Actively Exploited :

2

Last Vulnerability Seen :

Nov. 26, 2024
Vulnerabilities

The following vulnerabilities are recorded MDM9607 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jun 14, 2022 CVE-2022-22084 HIGH
8.4
2 Jun 14, 2022 CVE-2022-22083 HIGH
7.5
3 Jun 14, 2022 CVE-2022-22082 HIGH
8.4
4 Jun 14, 2022 CVE-2022-22072 HIGH
7.8
5 Jun 14, 2022 CVE-2022-22065 HIGH
7.5
6 Jun 14, 2022 CVE-2022-22064 HIGH
7.5
7 Jun 14, 2022 CVE-2021-35116 HIGH
7.7
8 Jun 14, 2022 CVE-2021-35104 CRITICAL
9.8
9 Jun 14, 2022 CVE-2021-35100 HIGH
7.5
10 Jun 14, 2022 CVE-2021-35083 CRITICAL
9.1
11 Jun 14, 2022 CVE-2021-35072 HIGH
7.8
12 Jun 14, 2022 CVE-2021-30344 HIGH
7.5
13 Jun 14, 2022 CVE-2021-30342 CRITICAL
9.1
14 Jun 14, 2022 CVE-2021-30341 CRITICAL
9.8
15 Apr 01, 2022 CVE-2021-35105 HIGH
8.4
16 Apr 01, 2022 CVE-2021-30333 HIGH
7.8
17 Feb 11, 2022 CVE-2021-30323 HIGH
7.8
18 Feb 11, 2022 CVE-2021-30318 HIGH
8.4
19 Jan 13, 2022 CVE-2021-30330 HIGH
7.5
20 Jan 13, 2022 CVE-2021-30319 HIGH
7.8
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Apr. 01, 2025 13:36