Product Detail

MDM9607 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

736

Average Exploit Prediction Score :

0.25

Public Exploit/PoC Code :

35

CISA Actively Exploited :

2

Last Vulnerability Seen :

Nov. 26, 2024
Vulnerabilities

The following vulnerabilities are recorded MDM9607 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jan 13, 2022 CVE-2021-30300 HIGH
7.5
2 Jan 03, 2022 CVE-2021-30351 CRITICAL
9.8
3 Jan 03, 2022 CVE-2021-30348 MEDIUM
6.5
4 Jan 03, 2022 CVE-2021-30337 HIGH
8.4
5 Jan 03, 2022 CVE-2021-30303 HIGH
7.8
6 Jan 03, 2022 CVE-2021-30293 HIGH
7.5
7 Jan 03, 2022 CVE-2021-30289 HIGH
7.8
8 Jan 03, 2022 CVE-2021-30273 HIGH
7.5
9 Jan 03, 2022 CVE-2021-30272 HIGH
7.8
10 Jan 03, 2022 CVE-2021-30271 HIGH
7.8
11 Jan 03, 2022 CVE-2021-30270 HIGH
7.8
12 Jan 03, 2022 CVE-2021-30268 HIGH
7.8
13 Nov 12, 2021 CVE-2021-30284 CRITICAL
9.1
14 Nov 12, 2021 CVE-2021-30255 HIGH
7.8
15 Nov 12, 2021 CVE-2021-30254 HIGH
7.8
16 Nov 12, 2021 CVE-2021-1975 CRITICAL
9.8
17 Nov 12, 2021 CVE-2021-1973 HIGH
7.8
18 Nov 12, 2021 CVE-2021-1924 CRITICAL
9.0
19 Oct 20, 2021 CVE-2021-30310 HIGH
7.5
20 Oct 20, 2021 CVE-2021-1977 CRITICAL
9.1
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Apr. 02, 2025 18:03