Product Detail

SDM670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

244

Average Exploit Prediction Score :

0.11

Public Exploit/PoC Code :

15

CISA Actively Exploited :

0

Last Vulnerability Seen :

Dec. 05, 2023
Vulnerabilities

The following vulnerabilities are recorded SDM670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Dec 05, 2023 CVE-2023-33080 HIGH
7.5
2 Dec 05, 2023 CVE-2023-33022 HIGH
8.4
3 Dec 05, 2023 CVE-2023-33018 HIGH
7.8
4 Dec 05, 2023 CVE-2023-33017 HIGH
7.8
5 Nov 07, 2023 CVE-2023-33059 HIGH
7.8
6 Oct 03, 2023 CVE-2023-33027 HIGH
7.5
7 Sep 05, 2023 CVE-2023-28560 HIGH
7.8
8 Jun 06, 2023 CVE-2023-21670 HIGH
7.8
9 Jun 06, 2023 CVE-2023-21659 HIGH
7.5
10 Jun 06, 2023 CVE-2023-21628 HIGH
8.4
11 Jun 06, 2023 CVE-2022-40529 HIGH
7.8
12 Jun 06, 2023 CVE-2022-40523 HIGH
7.1
13 Jun 06, 2023 CVE-2022-40521 HIGH
7.5
14 Jun 06, 2023 CVE-2022-40507 HIGH
8.4
15 Jun 06, 2023 CVE-2022-33307 HIGH
8.4
16 Jun 06, 2023 CVE-2022-33264 HIGH
7.9
17 Jun 06, 2023 CVE-2022-22076 HIGH
7.1
18 May 02, 2023 CVE-2022-40504 HIGH
7.5
19 May 02, 2023 CVE-2022-33273 HIGH
7.3
20 May 02, 2023 CVE-2023-21666 HIGH
8.4
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 14, 2024 4:27