Product Detail

SDM670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

244

Average Exploit Prediction Score :

0.11

Public Exploit/PoC Code :

15

CISA Actively Exploited :

0

Last Vulnerability Seen :

Dec. 05, 2023
Vulnerabilities

The following vulnerabilities are recorded SDM670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 May 02, 2023 CVE-2023-21665 HIGH
8.4
2 Apr 13, 2023 CVE-2022-40532 HIGH
8.4
3 Apr 13, 2023 CVE-2022-40503 HIGH
8.2
4 Apr 13, 2023 CVE-2022-33302 HIGH
7.8
5 Apr 13, 2023 CVE-2022-33296 HIGH
7.8
6 Apr 13, 2023 CVE-2022-33289 MEDIUM
6.8
7 Apr 13, 2023 CVE-2022-33288 CRITICAL
9.3
8 Apr 13, 2023 CVE-2022-33269 CRITICAL
9.3
9 Apr 13, 2023 CVE-2022-33231 CRITICAL
9.3
10 Jun 14, 2022 CVE-2021-30327 HIGH
7.5
11 Nov 12, 2020 CVE-2020-3639 CRITICAL
9.8
12 Nov 12, 2020 CVE-2020-11202 HIGH
7.8
13 Nov 12, 2020 CVE-2020-11196 CRITICAL
9.8
14 Nov 12, 2020 CVE-2020-11193 CRITICAL
9.8
15 Nov 12, 2020 CVE-2020-11175 HIGH
7.8
16 Nov 12, 2020 CVE-2020-11132 HIGH
7.1
17 Nov 12, 2020 CVE-2020-11123 MEDIUM
5.5
18 Nov 02, 2020 CVE-2020-3704 HIGH
7.5
19 Nov 02, 2020 CVE-2020-3703 CRITICAL
9.8
20 Nov 02, 2020 CVE-2020-3690 HIGH
7.8
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 13, 2024 0:36