Product Detail

SD870 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

379

Average Exploit Prediction Score :

0.08

Public Exploit/PoC Code :

34

CISA Actively Exploited :

3

Last Vulnerability Seen :

Sep. 05, 2023
Vulnerabilities

The following vulnerabilities are recorded SD870 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jun 14, 2022 CVE-2021-30334 HIGH
8.4
2 Jun 14, 2022 CVE-2021-30281 HIGH
8.4
3 Apr 01, 2022 CVE-2021-35117 CRITICAL
9.1
4 Apr 01, 2022 CVE-2021-35106 HIGH
7.8
5 Apr 01, 2022 CVE-2021-35105 HIGH
8.4
6 Apr 01, 2022 CVE-2021-35103 HIGH
7.8
7 Apr 01, 2022 CVE-2021-35088 CRITICAL
9.1
8 Apr 01, 2022 CVE-2021-30333 HIGH
7.8
9 Apr 01, 2022 CVE-2021-30332 HIGH
7.5
10 Apr 01, 2022 CVE-2021-30331 MEDIUM
5.5
11 Apr 01, 2022 CVE-2021-30329 HIGH
7.5
12 Apr 01, 2022 CVE-2021-30328 HIGH
7.5
13 Apr 01, 2022 CVE-2021-1950 HIGH
7.8
14 Apr 01, 2022 CVE-2021-1942 CRITICAL
9.3
15 Feb 11, 2022 CVE-2021-35077 HIGH
8.4
16 Feb 11, 2022 CVE-2021-35069 HIGH
7.8
17 Feb 11, 2022 CVE-2021-35068 CRITICAL
9.8
18 Feb 11, 2022 CVE-2021-30326 HIGH
7.5
19 Feb 11, 2022 CVE-2021-30325 MEDIUM
6.7
20 Feb 11, 2022 CVE-2021-30324 MEDIUM
6.7
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Latest DB Update: Nov. 23, 2024 5:29