Product Detail

SD870 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

379

Average Exploit Prediction Score :

0.08

Public Exploit/PoC Code :

34

CISA Actively Exploited :

3

Last Vulnerability Seen :

Sep. 05, 2023
Vulnerabilities

The following vulnerabilities are recorded SD870 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jun 14, 2022 CVE-2022-22071 HIGH
8.4
2 Jun 14, 2022 CVE-2022-22068 HIGH
8.4
3 Jun 14, 2022 CVE-2022-22065 HIGH
7.5
4 Jun 14, 2022 CVE-2022-22064 HIGH
7.5
5 Jun 14, 2022 CVE-2022-22057 HIGH
8.4
6 Jun 14, 2022 CVE-2021-35123 HIGH
8.8
7 Jun 14, 2022 CVE-2021-35121 MEDIUM
6.7
8 Jun 14, 2022 CVE-2021-35120 MEDIUM
6.7
9 Jun 14, 2022 CVE-2021-35119 MEDIUM
5.5
10 Jun 14, 2022 CVE-2021-35118 MEDIUM
6.7
11 Jun 14, 2022 CVE-2021-35116 HIGH
7.7
12 Jun 14, 2022 CVE-2021-35112 HIGH
8.4
13 Jun 14, 2022 CVE-2021-35111 HIGH
7.5
14 Jun 14, 2022 CVE-2021-35104 CRITICAL
9.8
15 Jun 14, 2022 CVE-2021-35102 HIGH
7.8
16 Jun 14, 2022 CVE-2021-35101 HIGH
7.1
17 Jun 14, 2022 CVE-2021-35100 HIGH
7.5
18 Jun 14, 2022 CVE-2021-35098 MEDIUM
6.7
19 Jun 14, 2022 CVE-2021-35096 HIGH
7.5
20 Jun 14, 2022 CVE-2021-35094 HIGH
7.8
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 23, 2024 4:33