Product Detail

QCM2290 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

362

Average Exploit Prediction Score :

0.08

Public Exploit/PoC Code :

34

CISA Actively Exploited :

7

Last Vulnerability Seen :

Nov. 04, 2024
Vulnerabilities

The following vulnerabilities are recorded QCM2290 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jan 03, 2022 CVE-2021-30274 HIGH
8.4
2 Jan 03, 2022 CVE-2021-30272 HIGH
7.8
3 Jan 03, 2022 CVE-2021-30270 HIGH
7.8
4 Jan 03, 2022 CVE-2021-30269 HIGH
7.8
5 Jan 03, 2022 CVE-2021-30268 HIGH
7.8
6 Jan 03, 2022 CVE-2021-1894 HIGH
7.8
7 Jan 03, 2022 CVE-2020-11263 HIGH
8.2
8 Nov 12, 2021 CVE-2021-30259 HIGH
7.8
9 Nov 12, 2021 CVE-2021-30255 HIGH
7.8
10 Nov 12, 2021 CVE-2021-30254 HIGH
7.8
11 Nov 12, 2021 CVE-2021-1973 HIGH
7.8
12 Nov 12, 2021 CVE-2021-1924 CRITICAL
9.0
13 Nov 12, 2021 CVE-2021-1903 MEDIUM
5.3
14 Oct 20, 2021 CVE-2021-30312 HIGH
7.5
15 Oct 20, 2021 CVE-2021-30310 HIGH
7.5
16 Oct 20, 2021 CVE-2021-30297 HIGH
8.4
17 Oct 20, 2021 CVE-2021-30292 HIGH
8.4
18 Oct 20, 2021 CVE-2021-30291 HIGH
8.4
19 Oct 20, 2021 CVE-2021-30288 HIGH
8.4
20 Oct 20, 2021 CVE-2021-30258 HIGH
8.4
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 23, 2024 5:34