Product Detail

QCM2290 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

358

Average Exploit Prediction Score :

0.08

Public Exploit/PoC Code :

33

CISA Actively Exploited :

7

Last Vulnerability Seen :

Sep. 02, 2024
Vulnerabilities

The following vulnerabilities are recorded QCM2290 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Sep 08, 2021 CVE-2021-1904 MEDIUM
6.2
2 Sep 08, 2021 CVE-2020-11301 CRITICAL
9.1
3 Sep 08, 2021 CVE-2020-11264 CRITICAL
9.8
4 Jul 13, 2021 CVE-2021-1970 HIGH
7.5
5 Jul 13, 2021 CVE-2021-1964 HIGH
7.5
6 Jul 13, 2021 CVE-2021-1955 HIGH
7.5
7 Jul 13, 2021 CVE-2021-1953 HIGH
7.5
8 Jul 13, 2021 CVE-2021-1945 HIGH
7.5
9 Jul 13, 2021 CVE-2021-1938 HIGH
7.5
10 Jul 13, 2021 CVE-2021-1931 MEDIUM
6.7
11 Jul 13, 2021 CVE-2021-1890 HIGH
8.4
12 Jul 13, 2021 CVE-2021-1889 HIGH
8.4
13 Jul 13, 2021 CVE-2021-1888 HIGH
8.4
14 Jul 13, 2021 CVE-2021-1886 HIGH
8.4
15 Jul 13, 2021 CVE-2020-11307 CRITICAL
9.8
16 Jun 09, 2021 CVE-2020-11306 HIGH
7.8
17 Jun 09, 2021 CVE-2020-11304 HIGH
7.8
18 Jun 09, 2021 CVE-2020-11298 HIGH
7.8
19 Jun 09, 2021 CVE-2020-11267 HIGH
8.4
20 Jun 09, 2021 CVE-2020-11262 HIGH
7.0
Showing 20 of 358 Results
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