Product Detail

SD460 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

380

Average Exploit Prediction Score :

0.08

Public Exploit/PoC Code :

30

CISA Actively Exploited :

4

Last Vulnerability Seen :

Sep. 02, 2024
Vulnerabilities

The following vulnerabilities are recorded SD460 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Sep 02, 2024 CVE-2024-33051 HIGH
7.5
2 Jul 01, 2024 CVE-2024-21469 HIGH
7.8
3 Jul 01, 2024 CVE-2024-21465 HIGH
7.8
4 Jul 01, 2024 CVE-2024-21462 HIGH
7.1
5 Jul 01, 2024 CVE-2024-21461 HIGH
8.4
6 Feb 06, 2024 CVE-2023-43536 HIGH
7.5
7 Feb 06, 2024 CVE-2023-43533 HIGH
7.5
8 Feb 06, 2024 CVE-2023-43522 HIGH
7.5
9 Feb 06, 2024 CVE-2023-33072 CRITICAL
9.3
10 Jan 02, 2024 CVE-2023-43511 HIGH
7.5
11 Jan 02, 2024 CVE-2023-33109 HIGH
7.5
12 Jan 02, 2024 CVE-2023-33062 HIGH
7.5
13 Jan 02, 2024 CVE-2023-33040 HIGH
7.5
14 Jan 02, 2024 CVE-2023-33038 HIGH
7.8
15 Jan 02, 2024 CVE-2023-33033 HIGH
8.4
16 Jan 02, 2024 CVE-2023-33030 CRITICAL
9.3
17 Dec 05, 2023 CVE-2023-33088 HIGH
8.4
18 Dec 05, 2023 CVE-2023-33080 HIGH
7.5
19 Dec 05, 2023 CVE-2023-33018 HIGH
7.8
20 Dec 05, 2023 CVE-2023-33017 HIGH
7.8
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 10, 2024 3:54