Product Detail

SD460 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

399

Average Exploit Prediction Score :

0.21

Public Exploit/PoC Code :

48

CISA Actively Exploited :

4

Last Vulnerability Seen :

Oct. 06, 2026
Vulnerabilities

The following vulnerabilities are recorded SD460 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Apr 01, 2024 CVE-2023-33023 HIGH
8.4
2 Apr 01, 2024 CVE-2023-28547 HIGH
8.4
3 Mar 04, 2024 CVE-2023-33066 HIGH
8.4
4 Mar 04, 2024 CVE-2023-28578 CRITICAL
9.3
5 Feb 06, 2024 CVE-2023-43536 HIGH
7.5
6 Feb 06, 2024 CVE-2023-43533 HIGH
7.5
7 Feb 06, 2024 CVE-2023-43522 HIGH
7.5
8 Feb 06, 2024 CVE-2023-33072 CRITICAL
9.3
9 Jan 02, 2024 CVE-2023-43511 HIGH
7.5
10 Jan 02, 2024 CVE-2023-33109 HIGH
7.5
11 Jan 02, 2024 CVE-2023-33062 HIGH
7.5
12 Jan 02, 2024 CVE-2023-33040 HIGH
7.5
13 Jan 02, 2024 CVE-2023-33038 HIGH
7.8
14 Jan 02, 2024 CVE-2023-33033 HIGH
8.4
15 Jan 02, 2024 CVE-2023-33030 CRITICAL
9.3
16 Dec 05, 2023 CVE-2023-33088 HIGH
8.4
17 Dec 05, 2023 CVE-2023-33080 HIGH
7.5
18 Dec 05, 2023 CVE-2023-33018 HIGH
7.8
19 Dec 05, 2023 CVE-2023-33017 HIGH
7.8
20 Dec 05, 2023 CVE-2023-28586 MEDIUM
6.5
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