Vendor
H
Hardware
QUALCOMM
has published 16223 vulnerabilities in 2024.
5 have exploits , 0 scored > 90% EPSS and 1 in CISA KEV .
Total Vulnerabilities Breakdown
12222
CRITICAL
46115
HIGH
4291
MEDIUM
62628
Total CVE Number
Vulnerability Stream by Days
Product Maturity Index
The following products are associated with the
QUALCOMM vendor. You can explore the
security posture of each product by clicking on the product name.
| Product Name | Number of CVE | Latest CVE Release Date |
|---|---|---|
| Snapdragon 7c gen 2 compute platform | 28 | Feb 06, 2024 |
| Snapdragon 7c gen 2 compute platform | 2 | Nov 07, 2023 |
| Snapdragon 7c gen 2 compute platform sc7180 ad rennell pro | 4 | Nov 04, 2024 |
| Snapdragon 7c gen 3 | 17 | Sep 02, 2024 |
| Snapdragon 7c gen 3 compute | 115 | Nov 04, 2024 |
| Snapdragon 7c gen3 compute | 1 | Jun 06, 2023 |
| Snapdragon 7 gen 1 | 1 | Sep 02, 2024 |
| Snapdragon 7 gen 1 mobile | 1 | Sep 02, 2024 |
| Snapdragon 7 gen 1 mobile platform | 1 | Oct 07, 2024 |
| Snapdragon 7 gen 2 | 1 | Sep 02, 2024 |
| Snapdragon 7 gen 2 mobile | 1 | Sep 02, 2024 |
| Snapdragon 7 gen 2 mobile platform | 1 | Oct 07, 2024 |
| Snapdragon 808 | 1 | Sep 05, 2023 |
| Snapdragon 808 processor | 3 | Jan 02, 2024 |
| Snapdragon 810 | 1 | Sep 05, 2023 |
| Snapdragon 810 processor | 3 | Jan 02, 2024 |
| Snapdragon 820 | 9 | Sep 05, 2023 |
| Snapdragon 820 automotive | 4 | Sep 02, 2024 |
| Snapdragon 820 automotive platform | 44 | Nov 04, 2024 |
| Snapdragon 820 automotive platform | 1 | Apr 13, 2023 |