Vendor
H
Hardware
QUALCOMM
has published 3770 vulnerabilities in 2024.
2 have exploits , 0 scored > 90% EPSS and 0 in CISA KEV .
Total Vulnerabilities Breakdown
42427
CRITICAL
115305
HIGH
17706
MEDIUM
175438
Total CVE Number
Vulnerability Stream by Days
Product Maturity Index
The following products are associated with the
QUALCOMM vendor. You can explore the
security posture of each product by clicking on the product name.
| Product Name | Number of CVE | Latest CVE Release Date |
|---|---|---|
| Snapdragon 7c gen3 compute | 1 | Jun 06, 2023 |
| Snapdragon 7 gen 1 | 1 | Sep 02, 2024 |
| Snapdragon 7 gen 1 mobile | 1 | Sep 02, 2024 |
| Snapdragon 7 gen 1 mobile platform | 2 | Oct 07, 2024 |
| Snapdragon 7 gen 2 | 1 | Sep 02, 2024 |
| Snapdragon 7 gen 2 mobile | 1 | Sep 02, 2024 |
| Snapdragon 7 gen 2 mobile platform | 2 | Oct 07, 2024 |
| Snapdragon 808 | 1 | Sep 05, 2023 |
| Snapdragon 808 processor | 3 | Jan 02, 2024 |
| Snapdragon 810 | 1 | Sep 05, 2023 |
| Snapdragon 810 processor | 3 | Jan 02, 2024 |
| Snapdragon 820 | 9 | Sep 05, 2023 |
| Snapdragon 820 automotive | 17 | Mar 03, 2025 |
| Snapdragon 820 automotive platform | 47 | Dec 02, 2024 |
| Snapdragon 820 automotive platform | 1 | Apr 13, 2023 |
| Snapdragon 820 mobile | 4 | Apr 01, 2024 |
| Snapdragon 820 mobile platform | 12 | Jul 01, 2024 |
| Snapdragon 821 | 2 | Sep 05, 2023 |
| Snapdragon 821 mobile | 3 | Apr 01, 2024 |
| Snapdragon 821 mobile platform | 11 | Jul 01, 2024 |