Vendor
H
Hardware
QUALCOMM
has published 10287 vulnerabilities in 2024.
8 have exploits , 0 scored > 90% EPSS and 3 in CISA KEV .
Total Vulnerabilities Breakdown
42600
CRITICAL
121481
HIGH
18207
MEDIUM
182288
Total CVE Number
Vulnerability Stream by Days
Product Maturity Index
The following products are associated with the
QUALCOMM
vendor. You can explore the
security posture of each product by clicking on the product name.
Product Name | Number of CVE | Latest CVE Release Date |
---|---|---|
Snapdragon 855 mobile platform sm8150 ac | 1 | Aug 05, 2024 |
Snapdragon 860 | 12 | Mar 03, 2025 |
Snapdragon 860 mobile | 38 | Jul 08, 2025 |
Snapdragon 860 mobile platform | 8 | Dec 02, 2024 |
Snapdragon 860 mobile platform sm8150 ac | 2 | Aug 05, 2024 |
Snapdragon 865 | 1 | Jul 04, 2023 |
Snapdragon 865 | 1 | Jul 04, 2023 |
Snapdragon 865 5g | 29 | Mar 03, 2025 |
Snapdragon 865 5g | 30 | Mar 03, 2025 |
Snapdragon 865 5g mobile | 62 | Jul 08, 2025 |
Snapdragon 865 5g mobile | 62 | Jul 08, 2025 |
Snapdragon 865 5g mobile platform | 79 | Dec 02, 2024 |
Snapdragon 865 5g mobile platform | 107 | Jun 03, 2025 |
Snapdragon 865 5g mobile platform sm8250 ab | 12 | Jun 03, 2025 |
Snapdragon 8657 5g | 1 | Mar 03, 2025 |
Snapdragon 8657 5g | 1 | Mar 03, 2025 |
Snapdragon 870 | 1 | Jul 04, 2023 |
Snapdragon 870 5 | 1 | Jul 04, 2023 |
Snapdragon 870 5g | 29 | Mar 03, 2025 |
Snapdragon 870 5g mobile | 62 | Jul 08, 2025 |