Vendor
H
Hardware
QUALCOMM
has published 6143 vulnerabilities in 2024.
3 have exploits , 0 scored > 90% EPSS and 3 in CISA KEV .
Total Vulnerabilities Breakdown
42458
CRITICAL
117647
HIGH
17706
MEDIUM
177811
Total CVE Number
Vulnerability Stream by Days
Product Maturity Index
The following products are associated with the
QUALCOMM vendor. You can explore the
security posture of each product by clicking on the product name.
| Product Name | Number of CVE | Latest CVE Release Date |
|---|---|---|
| Snapdragon 865 5g mobile platform sm8250 ab | 12 | Jun 03, 2025 |
| Snapdragon 8657 5g | 1 | Mar 03, 2025 |
| Snapdragon 870 | 1 | Jul 04, 2023 |
| Snapdragon 870 5 | 1 | Jul 04, 2023 |
| Snapdragon 870 5g | 26 | Mar 03, 2025 |
| Snapdragon 870 5g mobile | 52 | May 06, 2025 |
| Snapdragon 870 5g mobile platform | 78 | Dec 02, 2024 |
| Snapdragon 870 5g mobile platform | 1 | Sep 05, 2023 |
| Snapdragon 870 5g mobile platform sm8250 ac | 12 | Jun 03, 2025 |
| Snapdragon 888 | 1 | Jul 04, 2023 |
| Snapdragon 888 | 1 | Jul 04, 2023 |
| Snapdragon 888 5g | 20 | Mar 03, 2025 |
| Snapdragon 888 5g | 20 | Mar 03, 2025 |
| Snapdragon 888 5g mobile | 46 | May 06, 2025 |
| Snapdragon 888 5g mobile | 46 | May 06, 2025 |
| Snapdragon 888 5g mobile platform | 62 | Dec 02, 2024 |
| Snapdragon 888 5g mobile platform | 2 | Nov 07, 2023 |
| Snapdragon 888 5g mobile platform | 92 | Jun 03, 2025 |
| Snapdragon 888 5g mobile platform sm8350 ac | 11 | Jun 03, 2025 |
| Snapdragon 8c compute | 2 | Sep 02, 2024 |