Product Detail

SD 670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

175

Average Exploit Prediction Score :

0.26

Public Exploit/PoC Code :

6

CISA Actively Exploited :

0

Last Vulnerability Seen :

Dec. 12, 2019
Vulnerabilities

The following vulnerabilities are recorded SD 670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jul 25, 2019 CVE-2019-2301 HIGH
7.8
2 Jul 25, 2019 CVE-2019-2299 HIGH
7.8
3 Jul 25, 2019 CVE-2019-2298 HIGH
7.8
4 Jul 25, 2019 CVE-2019-2293 HIGH
7.8
5 Jul 25, 2019 CVE-2019-2290 HIGH
7.8
6 Jul 25, 2019 CVE-2019-2281 HIGH
7.8
7 Jul 25, 2019 CVE-2019-2278 HIGH
7.8
8 Jul 25, 2019 CVE-2019-2276 CRITICAL
9.8
9 Jul 25, 2019 CVE-2019-2273 HIGH
7.5
10 Jul 25, 2019 CVE-2019-2272 HIGH
7.8
11 Jul 25, 2019 CVE-2019-2263 HIGH
7.8
12 Jul 25, 2019 CVE-2019-2254 CRITICAL
9.8
13 Jul 25, 2019 CVE-2019-2253 CRITICAL
9.8
14 Jul 25, 2019 CVE-2019-2241 MEDIUM
5.5
15 Jul 25, 2019 CVE-2019-2240 MEDIUM
5.5
16 Jul 25, 2019 CVE-2019-2239 MEDIUM
5.5
17 Jul 25, 2019 CVE-2019-2238 HIGH
7.8
18 Jul 25, 2019 CVE-2019-2237 MEDIUM
5.5
19 Jul 25, 2019 CVE-2019-2236 MEDIUM
5.5
20 Jul 25, 2019 CVE-2019-2235 HIGH
7.8
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 23, 2024 1:29