Product Detail

SD 670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

175

Average Exploit Prediction Score :

0.22

Public Exploit/PoC Code :

6

CISA Actively Exploited :

0

Last Vulnerability Seen :

Dec. 12, 2019
Vulnerabilities

The following vulnerabilities are recorded SD 670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jun 14, 2019 CVE-2018-13919 HIGH
7.8
2 Jun 14, 2019 CVE-2018-13911 CRITICAL
9.8
3 Jun 14, 2019 CVE-2018-13909 HIGH
7.0
4 Jun 14, 2019 CVE-2018-13908 HIGH
7.8
5 Jun 14, 2019 CVE-2018-13907 MEDIUM
5.3
6 Jun 14, 2019 CVE-2018-13906 CRITICAL
9.1
7 Jun 14, 2019 CVE-2018-13902 HIGH
7.5
8 Jun 14, 2019 CVE-2018-13901 MEDIUM
5.5
9 Jun 14, 2019 CVE-2018-13898 CRITICAL
9.8
10 Jun 14, 2019 CVE-2018-11955 CRITICAL
9.8
11 Jun 14, 2019 CVE-2018-11947 MEDIUM
5.5
12 Jun 14, 2019 CVE-2018-11942 MEDIUM
5.5
13 Jun 14, 2019 CVE-2018-11934 HIGH
7.8
14 Jun 14, 2019 CVE-2018-11929 HIGH
7.8
15 Jun 14, 2019 CVE-2017-8252 MEDIUM
5.5
16 May 24, 2019 CVE-2019-2250 HIGH
7.8
17 May 24, 2019 CVE-2019-2247 HIGH
7.8
18 May 24, 2019 CVE-2019-2245 CRITICAL
9.8
19 May 24, 2019 CVE-2019-2244 CRITICAL
9.8
20 May 24, 2019 CVE-2018-13925 CRITICAL
9.8
Showing 20 of 175 Results
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