Product Detail

SD 670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

175

Average Exploit Prediction Score :

0.22

Public Exploit/PoC Code :

6

CISA Actively Exploited :

0

Last Vulnerability Seen :

Dec. 12, 2019
Vulnerabilities

The following vulnerabilities are recorded SD 670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Feb 25, 2019 CVE-2018-11820 MEDIUM
5.5
2 Feb 25, 2019 CVE-2018-11289 HIGH
7.8
3 Feb 11, 2019 CVE-2018-13888 HIGH
7.8
4 Feb 11, 2019 CVE-2018-11899 HIGH
7.8
5 Jan 18, 2019 CVE-2018-5915 CRITICAL
9.8
6 Jan 18, 2019 CVE-2018-5868 HIGH
7.8
7 Jan 18, 2019 CVE-2018-5867 HIGH
7.8
8 Jan 18, 2019 CVE-2018-3595 MEDIUM
5.5
9 Jan 18, 2019 CVE-2018-11288 HIGH
7.8
10 Jan 18, 2019 CVE-2018-11279 HIGH
8.8
11 Jan 18, 2019 CVE-2017-18332 MEDIUM
5.5
12 Jan 03, 2019 CVE-2017-18329 HIGH
7.8
13 Jan 03, 2019 CVE-2017-18327 MEDIUM
5.5
14 Jan 03, 2019 CVE-2017-18323 MEDIUM
5.5
15 Jan 03, 2019 CVE-2017-18320 HIGH
7.8
Showing 20 of 175 Results
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