Product Detail

SDM670 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

244

Average Exploit Prediction Score :

0.11

Public Exploit/PoC Code :

15

CISA Actively Exploited :

0

Last Vulnerability Seen :

Dec. 05, 2023
Vulnerabilities

The following vulnerabilities are recorded SDM670 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Sep 08, 2020 CVE-2019-10596 HIGH
7.8
2 Sep 08, 2020 CVE-2019-10562 HIGH
7.8
3 Sep 08, 2020 CVE-2019-10527 HIGH
7.8
4 Jul 30, 2020 CVE-2020-3688 CRITICAL
9.8
5 Jul 30, 2020 CVE-2019-14101 HIGH
7.1
6 Jul 30, 2020 CVE-2019-14037 HIGH
7.8
7 Jun 22, 2020 CVE-2020-3676 HIGH
7.8
8 Jun 22, 2020 CVE-2020-3663 CRITICAL
9.8
9 Jun 22, 2020 CVE-2020-3661 CRITICAL
9.8
10 Jun 22, 2020 CVE-2020-3658 CRITICAL
9.1
11 Jun 22, 2020 CVE-2020-3642 HIGH
7.8
12 Jun 22, 2020 CVE-2020-3635 HIGH
7.8
13 Jun 22, 2020 CVE-2020-3626 HIGH
7.8
14 Jun 22, 2020 CVE-2020-3614 CRITICAL
9.8
15 Jun 22, 2020 CVE-2019-14094 HIGH
7.8
16 Jun 22, 2020 CVE-2019-14080 CRITICAL
9.8
17 Jun 22, 2020 CVE-2019-14076 HIGH
7.8
18 Jun 22, 2020 CVE-2019-14073 CRITICAL
9.8
19 Jun 22, 2020 CVE-2019-14062 CRITICAL
9.8
20 Jun 22, 2020 CVE-2019-10626 MEDIUM
5.5
SEVERITY DISTRIBUTION CHART
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Latest DB Update: Nov. 26, 2024 12:29