Product Detail

SDM630 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

553

Average Exploit Prediction Score :

0.16

Public Exploit/PoC Code :

33

CISA Actively Exploited :

3

Last Vulnerability Seen :

Aug. 08, 2023
Vulnerabilities

The following vulnerabilities are recorded SDM630 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jun 14, 2019 CVE-2018-13907 MEDIUM
5.3
2 Jun 14, 2019 CVE-2018-13906 CRITICAL
9.1
3 Jun 14, 2019 CVE-2018-13902 HIGH
7.5
4 Jun 14, 2019 CVE-2018-13901 MEDIUM
5.5
5 Jun 14, 2019 CVE-2018-13898 CRITICAL
9.8
6 Jun 14, 2019 CVE-2018-11947 MEDIUM
5.5
7 Jun 14, 2019 CVE-2018-11942 MEDIUM
5.5
8 Jun 14, 2019 CVE-2018-11934 HIGH
7.8
9 Jun 14, 2019 CVE-2018-11929 HIGH
7.8
10 Jun 14, 2019 CVE-2017-8252 MEDIUM
5.5
11 May 24, 2019 CVE-2019-2247 HIGH
7.8
12 May 24, 2019 CVE-2019-2245 CRITICAL
9.8
13 May 24, 2019 CVE-2019-2244 CRITICAL
9.8
14 May 24, 2019 CVE-2018-13925 CRITICAL
9.8
15 May 24, 2019 CVE-2018-13920 HIGH
7.8
16 May 24, 2019 CVE-2018-13899 HIGH
7.8
17 May 24, 2019 CVE-2018-13895 HIGH
7.8
18 May 24, 2019 CVE-2018-13887 CRITICAL
9.8
19 May 24, 2019 CVE-2018-13886 CRITICAL
9.8
20 May 24, 2019 CVE-2018-13885 MEDIUM
5.5
Showing 20 of 553 Results
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