Product Detail

SDM630 FIRMWARE

Vendor :

Qualcomm

Number of CVE:

553

Average Exploit Prediction Score :

0.16

Public Exploit/PoC Code :

33

CISA Actively Exploited :

3

Last Vulnerability Seen :

Aug. 08, 2023
Vulnerabilities

The following vulnerabilities are recorded SDM630 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Jul 22, 2019 CVE-2019-2269 CRITICAL
9.8
2 Jul 22, 2019 CVE-2019-2264 HIGH
7.8
3 Jul 22, 2019 CVE-2019-2261 MEDIUM
5.5
4 Jul 22, 2019 CVE-2019-2260 HIGH
7.0
5 Jul 22, 2019 CVE-2019-2243 MEDIUM
5.5
6 Jul 22, 2019 CVE-2018-13927 HIGH
7.8
7 Jul 22, 2019 CVE-2018-13924 CRITICAL
9.8
8 Jul 22, 2019 CVE-2018-13896 HIGH
7.8
9 Jun 14, 2019 CVE-2019-2259 CRITICAL
9.8
10 Jun 14, 2019 CVE-2019-2256 CRITICAL
9.8
11 Jun 14, 2019 CVE-2019-2255 CRITICAL
9.8
12 Jun 14, 2019 CVE-2018-5913 HIGH
7.8
13 Jun 14, 2019 CVE-2018-5911 HIGH
7.8
14 Jun 14, 2019 CVE-2018-5903 HIGH
7.8
15 Jun 14, 2019 CVE-2018-5883 HIGH
7.8
16 Jun 14, 2019 CVE-2018-3583 HIGH
7.8
17 Jun 14, 2019 CVE-2018-13919 HIGH
7.8
18 Jun 14, 2019 CVE-2018-13911 CRITICAL
9.8
19 Jun 14, 2019 CVE-2018-13909 HIGH
7.0
20 Jun 14, 2019 CVE-2018-13908 HIGH
7.8
Showing 20 of 553 Results
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